Inventor · disambiguated record
Jun Oyabu
Also filed as: OYABU JUN
7 granted patents·5 pending applications·657 citations·filing 2000–2020
83Inventor score
Top patents by PatentIndex Score
12 records- 0195US6673196B1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Jan 6, 2004·627 cites·5 claims
- 0276US6508199B1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Jan 21, 2003·24 cites·12 claims
- 0372US9643380B2Carbon fibre reinforced composite material and production method thereofINOUE MTP KK·Filed 2012·Granted May 9, 2017·4 cites·10 claims
- 0470US10086581B2Carbon fiber composite materialINOUE MTP KK·Filed 2015·Granted Oct 2, 2018·1 cites·9 claims
- 0565US9524847B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Dec 20, 2016·1 cites·9 claims
- 0652US2009223932A1Electrode unit, substrate processing apparatus, and temperature control method for electrode unitTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 0751US2022402238A1Fiber-reinforced-resin composite molded article and method for producing same, antibacterial composite molded article and method for producing same, antibacterial fiber-reinforced resin composite molded article and method for producing same, and fiber-reinforced-resin laminated molded article and method for producing sameINOUE MTP KK·Filed 2020·Application pending·0 cites
- 0849US2008236746A1Substrate processing apparatus and substrate mounting stage on which focus ring is mountedTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 0946US2007215284A1Plasma processing apparatus and electrode assembly for plasma processing apparatusTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 1044US8592319B2Substrate processing method and substrate processing apparatusWADA NOBUHIRO·Filed 2011·Granted Nov 26, 2013·0 cites·7 claims
- 1140US2012273135A1Electrode unit, substrate processing apparatus, and temperature control method for electrode unitHIDA TSUYOSHI·Filed 2012·Application pending·0 cites
- 1235US8426318B2Method of setting thickness of dielectric and substrate processing apparatus having dielectric disposed in electrodeOYABU JUN·Filed 2011·Granted Apr 23, 2013·0 cites·4 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →