Inventor · disambiguated record
Kenji Nagasaki
Also filed as: NAGASAKI KENJI
20 granted patents·2 pending applications·311 citations·filing 1998–2024
95Inventor score
Files withDENSO CORP6OKI ELECTRIC IND CO LTD5NAGASAKI KENJI3TOYOTA MOTOR CO LTD3SANWA PACKING IND CO LTD2
Top patents by PatentIndex Score
22 records- 0194US7284530B2Leak detector for fuel vapor purge systemTOYOTA MOTOR CO LTD·Filed 2005·Granted Oct 23, 2007·26 cites·12 claims
- 0293US6722348B2Abnormality detecting apparatus for fuel vapor treating system and method for controlling the apparatusTOYOTA MOTOR CO LTD·Filed 2002·Granted Apr 20, 2004·41 cites·39 claims
- 0389US7004013B2Evaporative emission leak detection system with brushless motorDENSO CORP·Filed 2003·Granted Feb 28, 2006·31 cites·31 claims
- 0488US6262482B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jul 17, 2001·104 cites·24 claims
- 0587US7341048B2Fuel vapor treatment apparatusDENSO CORP·Filed 2006·Granted Mar 11, 2008·17 cites·8 claims
- 0686US7165447B2Failure diagnostic apparatus for fuel vapor purge system and fuel vapor purge apparatus and combustion engine having failure diagnostic apparatusDENSO CORP·Filed 2005·Granted Jan 23, 2007·14 cites·14 claims
- 0783US8242610B2Semiconductor device and method of fabricating semiconductor deviceYAMAGUCHI TADASHI·Filed 2009·Granted Aug 14, 2012·11 cites·3 claims
- 0880US6848298B2Apparatus and method for failure diagnosis of fuel vapor purge systemTOYOTA MOTOR CO LTD·Filed 2002·Granted Feb 1, 2005·20 cites·15 claims
- 0971US7165446B2Failure diagnostic apparatus for fuel vapor purge system and fuel vapor purge apparatus and combustion engine having failure diagnostic apparatusDENSO CORP·Filed 2005·Granted Jan 23, 2007·6 cites·8 claims
- 1067US7122910B2Packaged semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Oct 17, 2006·12 cites·16 claims
- 1165US8011902B2Drive control device of fuel pumpDENSO CORP·Filed 2007·Granted Sep 6, 2011·6 cites·12 claims
- 1263US7687320B2Manufacturing method for packaged semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Mar 30, 2010·2 cites·12 claims
- 1361US8237450B2Method of testing insulation property of wafer-level chip scale package and TEG pattern used in the methodNAGASAKI KENJI·Filed 2009·Granted Aug 7, 2012·2 cites·18 claims
- 1460US8200412B2Controller for internal combustion engineNAGASAKI KENJI·Filed 2007·Granted Jun 12, 2012·3 cites·10 claims
- 1560US2024191773A1Shock absorber and metal coverSANWA PACKING IND CO LTD·Filed 2024·Application pending·0 cites
- 1652US7066017B2Method of detecting pressure leakage in evaporated fuel control system for use in automobileDENSO CORP·Filed 2002·Granted Jun 27, 2006·5 cites·10 claims
- 1751US9129966B2Semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·16 claims
- 1846US2021239028A1Shock absorber and metal coverSANWA PACKING IND CO LTD·Filed 2019·Application pending·0 cites
- 1944US6913951B2Method of making a lead-on-chip deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jul 5, 2005·1 cites·7 claims
- 2044US6534845B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1999·Granted Mar 18, 2003·10 cites·22 claims
- 2143US8581408B2Semiconductor deviceNAGASAKI KENJI·Filed 2010·Granted Nov 12, 2013·0 cites·17 claims
- 2243US7498676B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2006·Granted Mar 3, 2009·0 cites·7 claims
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