Inventor

CHIU CHIA-PIN

US121 patents

⚠️ This page may combine multiple inventors who share the name “CHIU CHIA-PIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIU CHIA-PIN

INTEL CORP

High density substrate routing in BBUL package

Dual-sided heat removal system

Method for making high density substrate interconnect using inkjet printing

Bridge interconnect with air gap in package assembly

Localized high density substrate routing

High density substrate routing in BBUL package

Folded BGA package design with shortened communication paths and more electrical routing flexibility

Dissipation of heat through keyboard using a heat pipe

Bumpless build-up layer package including an integrated heat spreader

Bumpless build-up layer package including an integrated heat spreader

High density substrate routing in BBUL package

Electronic package having a flexible substrate with ends connected to one another

Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device

High density substrate interconnect formed through inkjet printing

Short carbon fiber enhanced thermal grease

High density substrate routing in package

High density substrate routing in BBUL package

Microelectronic die cooling device including bonding posts and method of forming same

Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device

Adhesive to attach a cooling device to a thermal interface

Apparatus and methods for cooling a processor socket

Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device

Thermal bus design to cool a microelectronic die

Push and pull dual-fan heat sink design

Localized high density substrate routing

Microelectronic package and method of cooling an interconnect feature in same

Low temperature phase change thermal interface material dam

Integrated circuit coolant microchannel assembly with targeted channel configuration

Thermal management arrangement for standardized peripherals

Thermal interface attach mechanism for electrical packages

Tall solders for through-mold interconnect

Thermal interface material on a mesh carrier

Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die

Method for an integrated circuit thermal grease mesh structure

Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments

Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly

Thermal bus bar design for an electronic cartridge

Method of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon

Microelectronic assemblies having a cooling channel

Heat sink for 5G massive antenna array and methods of assembling same

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Localized high density substrate routing

Fluid-cooled heat dissipation device

Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same

Cooling solutions for die-down integrated circuit packages

BRAUNISCH HENNING

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

STARKSTON ROBERT

Localized high density substrate routing

CHIU CHIA-PIN

Bridge interconnect with air gap in package assembly