Inventor · disambiguated record
Mostafa Aghazadeh
Also filed as: AGHAZADEH MOSTAFA · AGHAZADEH MOSTAFA A
8 granted patents·1 pending application·501 citations·filing 1992–2022
90Inventor score
Files withINTEL CORP9
Top patents by PatentIndex Score
9 records- 0190US5513070ADissipation of heat through keyboard using a heat pipeINTEL CORP·Filed 1994·Granted Apr 30, 1996·161 cites·19 claims
- 0283US5621613AApparatus for dissipating heat in a hinged computing deviceINTEL CORP·Filed 1996·Granted Apr 15, 1997·118 cites·25 claims
- 0381US5838542AProcessor card assembly including a heat sink attachment plate and an EMI/ESD shielding cageINTEL CORP·Filed 1996·Granted Nov 17, 1998·81 cites·9 claims
- 0478US5289337AHeatspreader for cavity down multi-chip module with flip chipINTEL CORP·Filed 1992·Granted Feb 22, 1994·66 cites·9 claims
- 0568US5808875AIntegrated circuit solder-rack interconnect moduleINTEL CORP·Filed 1997·Granted Sep 15, 1998·37 cites·11 claims
- 0663US5556811AMethod of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereonINTEL CORP·Filed 1995·Granted Sep 17, 1996·29 cites·6 claims
- 0748US2024006358A1Substrate trench for improved hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 0844US11679407B2Liquid metal thermal interface material applicationINTEL CORP·Filed 2020·Granted Jun 20, 2023·0 cites·9 claims
- 0940US5621245AApparatus for optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereonINTEL CORP·Filed 1996·Granted Apr 15, 1997·9 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →