Inventor · disambiguated record
Linbo Shi
Also filed as: SHI LINBO
2 granted patents·4 citations·filing 2016–2018
41Inventor score
Top patents by PatentIndex Score
2 records- 0177US10134698B2Bonding pad structure, bonding ring structure, and MEMS device packaging methodSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Nov 20, 2018·4 cites·11 claims
- 0244US10381398B2Method for manufacturing semiconductor apparatusSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2018·Granted Aug 13, 2019·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →