Inventor · disambiguated record
Curtis C. Hainds
Also filed as: HAINDS CURTIS · HAINDS CURTIS C
3 granted patents·1 pending application·287 citations·filing 1999–2007
78Inventor score
Top patents by PatentIndex Score
4 records- 0196US6288454B1Semiconductor wafer having a layer-to-layer alignment mark and method for fabricating the sameLSI LOGIC CORP·Filed 2000·Granted Sep 11, 2001·216 cites·4 claims
- 0284US6594604B2S-parameter measurement system for wideband non-linear networksCREDENCE SYSTEMS CORP·Filed 2001·Granted Jul 15, 2003·32 cites·25 claims
- 0373US6136662ASemiconductor wafer having a layer-to-layer alignment mark and method for fabricating the sameLSI LOGIC CORP·Filed 1999·Granted Oct 24, 2000·39 cites·14 claims
- 0435US2008238461A1Multi-type test interface system and methodSKALA KEN·Filed 2007·Application pending·0 cites
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