Inventor · disambiguated record
Yoshihito Hagiwara
Also filed as: HAGIWARA YOSHIHITO
8 granted patents·1 pending application·17 citations·filing 2013–2018
79Inventor score
Technology areasH10W
Files withSHINKAWA KK9
Top patents by PatentIndex Score
9 records- 0187US9337166B2Wire bonding apparatus and bonding methodSHINKAWA KK·Filed 2013·Granted May 10, 2016·9 cites·10 claims
- 0283US10978420B2Semiconductor chip mounting apparatus and semiconductor chip mounting methodSHINKAWA KK·Filed 2018·Granted Apr 13, 2021·4 cites·20 claims
- 0375US11512411B2PTFE sheet and method for mounting dieSHINKAWA KK·Filed 2018·Granted Nov 29, 2022·2 cites·6 claims
- 0474US11189594B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2018·Granted Nov 30, 2021·2 cites·9 claims
- 0545US2016163673A1Wire bonding apparatus and bonding methodSHINKAWA KK·Filed 2016·Application pending·0 cites
- 0638US11069651B2Method of mounting dieSHINKAWA KK·Filed 2017·Granted Jul 20, 2021·0 cites·8 claims
- 0738US9922952B2Method for producing semiconductor device, and wire-bonding apparatusSHINKAWA KK·Filed 2016·Granted Mar 20, 2018·0 cites·13 claims
- 0836US10566307B2Manufacturing method of semiconductor deviceSHINKAWA KK·Filed 2016·Granted Feb 18, 2020·0 cites·3 claims
- 0936US10410992B2Ball forming device, wire-bonding apparatus, and ball formation methodSHINKAWA KK·Filed 2016·Granted Sep 10, 2019·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →