Inventor

KANG PIL-KYU

KR56 patents

⚠️ This page may combine multiple inventors who share the name “KANG PIL-KYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANG PIL-KYU

SAMSUNG ELECTRONICS CO LTD

Wafer-to-wafer bonding structure

Wafer-to-wafer bonding structure

Wafer temporary bonding method using silicon direct bonding

Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate

Methods of fabricating nonvolatile memory devices

Method of fabricating multi-substrate semiconductor devices

Semiconductor devices

Photodetector structures including cross-sectional waveguide boundaries

Method of manufacturing substrate structure

Multi-stacked device having TSV structure

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor devices having hybrid stacking structures and methods of fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Wafer processing methods

Semiconductor device including through via structures and redistribution structures

Semiconductor device

Wafer bonding apparatus and wafer bonding system including the same

Method of manufacturing a semiconductor device

Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same

Semiconductor devices having through-electrodes and methods for fabricating the same

Methods of manufacturing semiconductor devices including a doped silicon layer

Semiconductor device

Method of fabricating a semiconductor device

Semiconductor laser device

Semiconductor device and method of fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Optical input/output device for photo-electric integrated circuit device and method of fabricating same

Methods of fabricating semiconductor devices having laser-formed single crystalline active structures

Three-dimensional semiconductor devices

KANG PIL-KYU

Methods of manufacturing nonvolatile memory devices

Buried-type optical input/output devices and methods of manufacturing the same

Stacked integrated circuit packages that include monolithic conductive vias

Semiconductor devices having optical transceiver

Semiconductor devices having through-electrodes and methods for fabricating the same

Optical input/output device for photo-electric integrated circuit device and method of fabricating same

Stacked integrated circuit package having recessed sidewalls

Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process

LEE HO-JIN

Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices

Semiconductor devices having conductive via structures and methods for fabricating the same

Semiconductor devices including protected barrier layers

JI HO-CHUL

Optical waveguide and coupler apparatus and method of manufacturing the same

Photodetector structure and method of manufacturing the same

MOON KWANG-JIN

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

JUNG DEOK-YOUNG

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

SHIN DONG-JAE

Optical modulator formed on bulk-silicon substrate

KIM TAEYEONG

Semiconductor devices having stacked structures and methods for fabricating the same

PARK YOUNG-SOO

Gettering structures and methods and their application