Inventor · disambiguated record
Wei Sen Chang
Also filed as: CHANG WEI SEN
36 granted patents·1 pending application·120 citations·filing 2010–2024
97Inventor score
Top patents by PatentIndex Score
37 records- 0196US9640521B2Multi-die package with bridge layer and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·15 cites·20 claims
- 0295US11348884B1Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·4 cites·20 claims
- 0395US8232193B2Method of forming Cu pillar capped by barrier layerCHANG WEI SEN·Filed 2010·Granted Jul 31, 2012·26 cites·20 claims
- 0494US10490468B2Semiconductor structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·8 cites·20 claims
- 0593US10008479B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 26, 2018·5 cites·20 claims
- 0693US9620465B1Dual-sided integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·8 cites·19 claims
- 0792US9870997B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·6 cites·20 claims
- 0890US9543278B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 10, 2017·4 cites·20 claims
- 0989US9165887B2Semiconductor device with discrete blocksHSIAO CHING-WEN·Filed 2012·Granted Oct 20, 2015·6 cites·17 claims
- 1089US8653659B2Integrated circuit device including a copper pillar capped by barrier layerCHANG WEI SEN·Filed 2012·Granted Feb 18, 2014·8 cites·20 claims
- 1188US12334476B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1287US10510727B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 1385US9735087B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 15, 2017·6 cites·20 claims
- 1485US9659896B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·4 cites·20 claims
- 1585US8766441B2Methods and apparatus for solder on slot connections in package on package structuresCHANG WEI SEN·Filed 2012·Granted Jul 1, 2014·8 cites·19 claims
- 1681US10861823B2Dual-sided integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·2 cites·20 claims
- 1781US2024379589A1Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1880US11855045B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1980US10276509B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 2079US9627339B2Method of forming an integrated circuit device including a pillar capped by barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 18, 2017·2 cites·20 claims
- 2178US12142582B2Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 2275US11769741B2Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 2374US9666530B1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·2 cites·20 claims
- 2474US9142521B2Integrated circuit device including a copper pillar capped by barrier layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 22, 2015·2 cites·20 claims
- 2572US11217562B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 2668US11476125B2Multi-die package with bridge layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 2764US10978363B2Semiconductor structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 2864US10978362B2Semiconductor structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 2960US11101192B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·0 cites·20 claims
- 3057US10177073B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 3157US10153249B2Dual-sided integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·0 cites·20 claims
- 3256US10840111B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
- 3356US9935024B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·20 claims
- 3455US10643861B2Methods for making multi-die package with bridge layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 5, 2020·0 cites·20 claims
- 3553US9899288B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 20, 2018·0 cites·20 claims
- 3652US9947552B2Structure and formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·19 claims
- 3744US9070667B2Peripheral electrical connection of package on packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 30, 2015·0 cites·21 claims
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