Inventor · disambiguated record
Barbara Waterhouse
Also filed as: WATERHOUSE BARBARA · WATERHOUSE BARBARA A · WATERHOUSE BARBARA ANN
8 granted patents·49 citations·filing 2003–2007
84Inventor score
Files withIBM8
Top patents by PatentIndex Score
8 records- 0171US7056820B2Bond padIBM·Filed 2003·Granted Jun 6, 2006·20 cites·17 claims
- 0266US7170181B2Optimum padset for wire bonding RF technologies with high-Q inductorsIBM·Filed 2003·Granted Jan 30, 2007·11 cites·9 claims
- 0364US7301752B2Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmaskIBM·Filed 2004·Granted Nov 27, 2007·10 cites·12 claims
- 0463US7754574B2Optimum padset for wire bonding RF technologies with high-Q inductorsIBM·Filed 2006·Granted Jul 13, 2010·2 cites·7 claims
- 0563US7326987B2Non-continuous encapsulation layer for MIM capacitorIBM·Filed 2005·Granted Feb 5, 2008·2 cites·14 claims
- 0652US6913965B2Non-Continuous encapsulation layer for MIM capacitorIBM·Filed 2004·Granted Jul 5, 2005·4 cites·9 claims
- 0751US7511940B2Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmaskIBM·Filed 2007·Granted Mar 31, 2009·0 cites·13 claims
- 0841US7245025B2Low cost bonding pad and method of fabricating sameIBM·Filed 2005·Granted Jul 17, 2007·0 cites·24 claims
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