Inventor · disambiguated record
Tseng-Shin Chiu
Also filed as: CHIU TSENG-SHIN
2 granted patents·2 pending applications·20 citations·filing 2006–2008
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0179US7408245B2IC package encapsulating a chip under asymmetric single-side leadsPOWERTECH TECHNOLOGY INC·Filed 2006·Granted Aug 5, 2008·14 cites·12 claims
- 0264US7633160B1Window-type semiconductor package to avoid peeling at moldflow entrancePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Dec 15, 2009·6 cites·15 claims
- 0338US2007290332A1Stacking structure of chip packagePOWERTECH TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 0436US2008272480A1Land grid array semiconductor packagePOWERTCH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →