Inventor · disambiguated record
Yu-Sheng Lin
Also filed as: LIN YU-SHENG · LIN YU-SHENG BRANDON
133 granted patents·71 pending applications·578 citations·filing 1998–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD102LIN YU-SHENG10IND TECH RES INST8ASUSTEK COMP INC7MEDIATEK INC7
Top patents by PatentIndex Score
204 records- 0198US7050504B2Low-complexity deblocking filterUB VIDEO INC·Filed 2002·Granted May 23, 2006·198 cites·6 claims
- 0297US11784130B2Structure and formation method of package with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·3 cites·20 claims
- 0396US7227901B2Low-complexity deblocking filterUB VIDEO INC·Filed 2002·Granted Jun 5, 2007·83 cites·118 claims
- 0495US11854929B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0595US11823991B2Frames stacked on substrate encircling devices and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·2 cites·20 claims
- 0694US11984378B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0794US11915991B2Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·2 cites·20 claims
- 0894US7869523B2Low complexity deblocking filterJOCH ANTHONY·Filed 2006·Granted Jan 11, 2011·19 cites·10 claims
- 0993US11784061B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 1093US11574861B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 7, 2023·2 cites·20 claims
- 1193US11450622B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·2 cites·20 claims
- 1293US7894534B2Low-complexity deblocking filterJOCH ANTHONY·Filed 2005·Granted Feb 22, 2011·16 cites·8 claims
- 1392US8375103B2System and method for file access and sharingD LINK CORP·Filed 2011·Granted Feb 12, 2013·50 cites·12 claims
- 1491US10510561B2Semiconductor device package including conformal metal cap contacting each semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·7 cites·20 claims
- 1590US11815369B2Differential capacitor device and method for calibrating differential capacitorIND TECH RES INST·Filed 2022·Granted Nov 14, 2023·2 cites·11 claims
- 1689US12234569B2Non-enzyme sensor, non-enzyme sensor element and fabricating method thereofUNIV NAT TSING HUA·Filed 2022·Granted Feb 25, 2025·1 cites·10 claims
- 1788US11676916B2Structure and formation method of package with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·1 cites·20 claims
- 1888US8000091B2Electrophoretic display apparatusE INK HOLDINGS INC·Filed 2008·Granted Aug 16, 2011·12 cites·19 claims
- 1987US11715731B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·1 cites·20 claims
- 2086US12183714B2Package structures and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 31, 2024·1 cites·20 claims
- 2186US12040285B2Structure and formation method of chip package with reinforcing structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 2286US10790164B1Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·4 cites·20 claims
- 2386US2025309141A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2485US12347793B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 2585US11913925B2Sensing devices and calibration method thereofIND TECH RES INST·Filed 2020·Granted Feb 27, 2024·1 cites·24 claims
- 2685US7956238B2Porcine pancreatic amylase gene promoter and transgenic pigs expressing heterologous digestive enzymesNAT TAIWAN UNIVERSITY AN UNIVERSITY OF TAIWAN R O C·Filed 2006·Granted Jun 7, 2011·21 cites·11 claims
- 2785US7509821B1Yarn measuring device for flat bed knitting machinesPAI LUNG MACHINERY MILL CO LTD·Filed 2008·Granted Mar 31, 2009·13 cites·4 claims
- 2884US12387991B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 2984US12362197B2Semiconductor die package with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 3084US11739450B2Circular knitting machine for prompting knitting machine status instantaneously based on cloth surface status of fabricPAI LUNG MACHINERY MILL CO LTD·Filed 2021·Granted Aug 29, 2023·2 cites·9 claims
- 3184US8387418B1Yarn feeder for flat knitting machinesLIN YU-SHENG·Filed 2011·Granted Mar 5, 2013·14 cites·11 claims
- 3284US2025323115A1Chip package structure with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3383US12406898B2Chip package structure with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 3483US12406897B2Package structure with buffer layer embedded in lid layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 3583US2025316543A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3682US12374561B2Chip package structure with ring damTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 3782US12322704B2Package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 3882US8381550B1Needle bed structure for flat knitting machinesPAI LUNG MACHINERY MILL CO LTD·Filed 2011·Granted Feb 26, 2013·11 cites·15 claims
- 3982US2025347602A1Test structures to determine integrated circuit bonding energies and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4081US12255118B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 4181US12119296B2Encircling a semiconductor device with stacked frames on a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 4281US12074101B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 4381US8305514B2Flexible display apparatusSHINN TED-HONG·Filed 2011·Granted Nov 6, 2012·4 cites·12 claims
- 4481US2025273581A1Package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4581US2025364522A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG COPMPANY LTD·Filed 2025·Application pending·0 cites
- 4681US2025364366A1Semiconductor package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4781US2025112217A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4880US12218023B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 4980US12191294B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 5080US12087705B2Package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
Showing the top 50 of 204 patent records by PatentIndex Score.
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