Inventor · disambiguated record
Joo Wan Hong
Also filed as: HONG JOO WAN
3 granted patents·26 citations·filing 2017–2023
61Inventor score
Files withSK HYNIX INC3
Top patents by PatentIndex Score
3 records- 0194US9941253B1Semiconductor packages including interconnectors and methods of fabricating the sameSK HYNIX INC·Filed 2017·Granted Apr 10, 2018·26 cites·17 claims
- 0267US12255183B2Semiconductor package including heat dissipation layerSK HYNIX INC·Filed 2023·Granted Mar 18, 2025·0 cites·17 claims
- 0363US11699684B2Semiconductor package including heat dissipation layerSK HYNIX INC·Filed 2021·Granted Jul 11, 2023·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →