Inventor · disambiguated record
Ming-Song Sheu
Also filed as: SHEU MING-SONG
13 granted patents·37 citations·filing 2009–2020
89Inventor score
Top patents by PatentIndex Score
13 records- 0192US8344416B2Integrated circuits using guard rings for ESD, systems, and methods for forming the integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 1, 2013·14 cites·19 claims
- 0287US8569886B2Methods and apparatus of under bump metallization in packaging semiconductor devicesTU CHIA-WEI·Filed 2011·Granted Oct 29, 2013·8 cites·20 claims
- 0380US9064881B2Protecting flip-chip package using pre-applied filletTSAI TSUNG-FU·Filed 2010·Granted Jun 23, 2015·4 cites·20 claims
- 0479US9748361B2Integrated circuits using guard rings for ESD systems, and methods for forming the integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 29, 2017·3 cites·20 claims
- 0578US8772092B2Integrated circuits using guard rings for ESD, systems, and methods for forming the integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 8, 2014·3 cites·20 claims
- 0675US10756079B2Methods for forming integrated circuit having guard ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 25, 2020·1 cites·14 claims
- 0773US10269750B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 0873US9136235B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 0971US11398467B2Methods for forming integrated circuit having guard ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 1062US8551835B2Electrostatic discharge protection device and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 8, 2013·1 cites·20 claims
- 1154US9659890B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·0 cites·20 claims
- 1254US8378422B2Electrostatic discharge protection device comprising a plurality of highly doped areas within a wellTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Feb 19, 2013·0 cites·19 claims
- 1351US9620414B2Protecting flip-chip package using pre-applied filletTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·0 cites·19 claims
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