Inventor · disambiguated record
Ru-Ying Huang
Also filed as: HUANG RU-YING
10 granted patents·1 pending application·18 citations·filing 2009–2023
84Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6HSIAO CHING-WEN2TAIWAN SEMICONDUCTOR MFG1TSAI TSUNG-FU1TU CHIA-WEI1
Top patents by PatentIndex Score
11 records- 0187US8569886B2Methods and apparatus of under bump metallization in packaging semiconductor devicesTU CHIA-WEI·Filed 2011·Granted Oct 29, 2013·8 cites·20 claims
- 0278US11996368B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 0377US8847387B2Robust joint structure for flip-chip bondingHSIAO CHING-WEN·Filed 2010·Granted Sep 30, 2014·5 cites·15 claims
- 0473US10269750B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 0573US9136235B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 0672US11728279B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 0761US9607936B2Copper bump joint structures with improved crack resistanceHSIAO CHING-WEN·Filed 2009·Granted Mar 28, 2017·2 cites·11 claims
- 0858US11227836B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·20 claims
- 0954US9659890B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·0 cites·20 claims
- 1051US10453818B2Packaging structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 1146US2013087925A1Packaging Structures of Integrated CircuitsTSAI TSUNG-FU·Filed 2011·Application pending·0 cites
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