Inventor · disambiguated record
Yian-Liang Kuo
Also filed as: KUO YIAN-LIANG
37 granted patents·8 pending applications·245 citations·filing 2003–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23TAIWAN SEMICONDUCTOR MFG11TSAI TSUNG-FU4CHOU YI-MANG2TU CHIA-WEI2
Top patents by PatentIndex Score
45 records- 0197US9196532B2Integrated circuit packages and methods for forming the sameTU CHIA-WEI·Filed 2012·Granted Nov 24, 2015·67 cites·20 claims
- 0297US8846548B2Post-passivation interconnect structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 30, 2014·56 cites·22 claims
- 0394US8581420B2Under-bump metallization (UBM) structure and method of forming the sameTSAI TSUNG-FU·Filed 2011·Granted Nov 12, 2013·21 cites·20 claims
- 0487US8569886B2Methods and apparatus of under bump metallization in packaging semiconductor devicesTU CHIA-WEI·Filed 2011·Granted Oct 29, 2013·8 cites·20 claims
- 0586US10056312B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·3 cites·19 claims
- 0685US8994155B2Packaging devices, methods of manufacture thereof, and packaging methodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 31, 2015·7 cites·20 claims
- 0784US2024395782A1Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0883US12431366B2Structure having thermal dissipation structure therein and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0983US2025308940A1Package structure having thermal dissipation structure therein and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1081US9780009B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·2 cites·20 claims
- 1181US8507316B2Protecting T-contacts of chip scale packages from moistureCHU HUI-CHEN·Filed 2010·Granted Aug 13, 2013·8 cites·20 claims
- 1280US9064881B2Protecting flip-chip package using pre-applied filletTSAI TSUNG-FU·Filed 2010·Granted Jun 23, 2015·4 cites·20 claims
- 1378US11996368B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 1478US7180173B2Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)TAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 20, 2007·25 cites·30 claims
- 1577US10770366B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·1 cites·20 claims
- 1677US8581399B2Metal bump structureTSAI TSUNG-FU·Filed 2011·Granted Nov 12, 2013·5 cites·19 claims
- 1775US2024192262A1Method of analyzing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1873US10269750B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 1973US9136235B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 2072US12159862B2Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 3, 2024·0 cites·19 claims
- 2172US11935760B2Package structure having thermal dissipation structure therein and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 2272US11728279B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 2370US11959958B2Method of analyzing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2470US7372153B2Integrated circuit package bond pad having plurality of conductive membersTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted May 13, 2008·16 cites·17 claims
- 2566US9059158B2Semiconductor device having under-bump metallization (UBM) structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 16, 2015·1 cites·20 claims
- 2665US8803338B2Semiconductor device having under-bump metallization (UBM) structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·1 cites·20 claims
- 2765US7102372B2Apparatus and method for testing conductive bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 5, 2006·10 cites·19 claims
- 2863US10867975B2Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 2963US8580657B2Protecting sidewalls of semiconductor chips using insulation filmsKUO YIAN-LIANG·Filed 2008·Granted Nov 12, 2013·4 cites·14 claims
- 3062US7439751B2Apparatus and method for testing conductive bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 21, 2008·2 cites·17 claims
- 3161US10955459B2Method of analyzing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 3261US10510635B2Integrated circuit packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 3358US11227836B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·20 claims
- 3457US2024096825A1Bond head with elastic material around perimeter to improve bonding qualityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3556US2025038073A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3654US10340258B2Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 2, 2019·0 cites·20 claims
- 3754US9659890B2Methods and apparatus of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·0 cites·20 claims
- 3851US10453818B2Packaging structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 3951US9620414B2Protecting flip-chip package using pre-applied filletTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·0 cites·19 claims
- 4047US7081209B2Solder mask removal methodTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jul 25, 2006·1 cites·10 claims
- 4146US2013087925A1Packaging Structures of Integrated CircuitsTSAI TSUNG-FU·Filed 2011·Application pending·0 cites
- 4239US8308052B2Thermal gradient reflow for forming columnar grain structures for solder bumpsCHANG CHIH-HORNG·Filed 2010·Granted Nov 13, 2012·0 cites·10 claims
- 4338US2005051893A1SBGA design for low-k integrated circuits (IC)TAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
- 4423US9053943B2Bond pad design for improved routing and reduced package stressCHOU YI-MANG·Filed 2011·Granted Jun 9, 2015·0 cites·20 claims
- 4523US2012329263A1Method of forming a bond pad design for improved routing and reduced package stressCHOU YI-MANG·Filed 2011·Application pending·0 cites
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