Inventor · disambiguated record
Hwee-Seng Jimmy Chew
Also filed as: CHEW HWEE S · CHEW HWEE S J · CHEW HWEE SENG · CHEW HWEE SENG J
32 granted patents·16 pending applications·73 citations·filing 1990–2024
95Inventor score
Files withADVANPACK SOLUTIONS PTE LTD21PEP INNOVATION PTE LTD13CHEW HWEE-SENG JIMMY9PYXIS CF PTE LTD2ADVANPACK SOLUTION PTES LTD1
Top patents by PatentIndex Score
48 records- 0195US9653323B2Manufacturing method of substrate structure having embedded interconnection layersADVANPACK SOLUTIONS PTE LTD·Filed 2016·Granted May 16, 2017·12 cites·14 claims
- 0291US8207608B2Interconnections for fine pitch semiconductor devices and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2007·Granted Jun 26, 2012·25 cites·26 claims
- 0389US10431477B2Method of packaging chip and chip package structurePEP INNOVATION PTE LTD·Filed 2017·Granted Oct 1, 2019·6 cites·42 claims
- 0486US11881415B2Method of packaging chip and chip package structurePEP INNOVATION PTE LTD·Filed 2021·Granted Jan 23, 2024·1 cites·9 claims
- 0585US12506055B2Chip packaging method and chip structurePEP INNOVATION PTE LTD·Filed 2021·Granted Dec 23, 2025·1 cites·15 claims
- 0680US9892916B2Manufacturing method of package substrate and package manufacturing method of semiconductor deviceADVANPACK SOLUTIONS PTE LTD·Filed 2016·Granted Feb 13, 2018·3 cites·14 claims
- 0779US11049734B2Method of packaging chip and chip package structurePEP INNOVATION PTE LTD·Filed 2017·Granted Jun 29, 2021·2 cites·32 claims
- 0877US8709874B2Manufacturing method for semiconductor device carrier and semiconductor package using the sameCHEW HWEE-SENG JIMMY·Filed 2011·Granted Apr 29, 2014·4 cites·28 claims
- 0975US9219027B2Semiconductor device carrier and semiconductor package using the sameADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Dec 22, 2015·3 cites·21 claims
- 1072US9301391B2Substrate structure, semiconductor package device, and manufacturing method of substrate structureADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Mar 29, 2016·2 cites·15 claims
- 1169US10615056B2Method of packaging chip and chip package structurePEP INNOVATION PTE LTD·Filed 2017·Granted Apr 7, 2020·1 cites·19 claims
- 1269US9379044B2Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Jun 28, 2016·2 cites·19 claims
- 1367US8917521B2Etch-back type semiconductor package, substrate and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2011·Granted Dec 23, 2014·2 cites·23 claims
- 1466US9362206B2Chip and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Jun 7, 2016·1 cites·25 claims
- 1564US8846519B2Interconnections for fine pitch semiconductor devices and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2012·Granted Sep 30, 2014·1 cites·17 claims
- 1664US2025149420A1Semiconductor package with at least one pre-made conductive unit and panel-level methods of making thereofPEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 1763US10049950B2Multi-layer substrate for semiconductor packagingADVANPACK SOLUTIONS PTE LTD·Filed 2013·Granted Aug 14, 2018·1 cites·23 claims
- 1863US2025022826A1Solder ball attachment system and method for preventing warpagePEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 1962US2025096017A1Apparatus and method for bonding a plurality of dies to a carrier panelPYXIS CF PTE LTD·Filed 2024·Application pending·0 cites
- 2062US2024404974A1Panel-level semiconductor packaging methodPEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 2161US2024387222A1Method of compensating die shift in the compression moldingPEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 2260US2024258260A1Semiconductor packaging method and the structure formed therefromPEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 2356US11990431B2Semiconductor structures with via openings and methods of making the samePEP INNOVATION PTE LTD·Filed 2021·Granted May 21, 2024·0 cites·17 claims
- 2455US10446457B2Multi-layer substrate for semiconductor packagingADVANPACK SOLUTIONS PTE LTD·Filed 2018·Granted Oct 15, 2019·0 cites·6 claims
- 2555US2025096182A1Power modules and panel-level methods of making the samePEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 2654US9754899B2Semiconductor structure and method of fabricating the sameADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Sep 5, 2017·0 cites·23 claims
- 2753US9305868B2Manufacturing method of forming an etch-back type semiconductor package with locking anchoragesADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Apr 5, 2016·0 cites·22 claims
- 2851US9723717B2Substrate structure, semiconductor package device, and manufacturing method of semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Aug 1, 2017·0 cites·8 claims
- 2951US9583449B2Semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2015·Granted Feb 28, 2017·0 cites·13 claims
- 3051US2016268225A1Chip and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2016·Application pending·0 cites
- 3150US11990353B2Semiconductor device with buffer layerPEP INNOVATION PTE LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 3250US10154588B2Manufacturing method of semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2017·Granted Dec 11, 2018·0 cites·16 claims
- 3350US8796844B2Package structureCHEW HWEE-SENG JIMMY·Filed 2009·Granted Aug 5, 2014·0 cites·30 claims
- 3449US9396982B2Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2008·Granted Jul 19, 2016·0 cites·10 claims
- 3549US2016329306A1Semiconductor package and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2016·Application pending·0 cites
- 3648US2017330842A1Semiconductor Assembly and Method of Fabricating a Semiconductor StructureADVANPACK SOLUTIONS PTE LTD·Filed 2017·Application pending·0 cites
- 3747US9120169B2Method for device packagingCHEW HWEE SENG·Filed 2009·Granted Sep 1, 2015·0 cites·17 claims
- 3846US8766438B2Package structureCHEW HWEE-SENG JIMMY·Filed 2009·Granted Jul 1, 2014·0 cites·22 claims
- 3945US9287157B2Semiconductor element for package miniaturizationCHEW HWEE-SENG JIMMY·Filed 2010·Granted Mar 15, 2016·0 cites·17 claims
- 4044US12183620B2Apparatus and method for bonding a plurality of dies to a carrier panelPYXIS CF PTE LTD·Filed 2021·Granted Dec 31, 2024·0 cites·15 claims
- 4143US2006180888A1Optical sensor package and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2005·Application pending·0 cites
- 4241US2008150107A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTION PTES LTD·Filed 2008·Application pending·0 cites
- 4339US2007284420A1Integrated circuit chip formed on substrateADVANPACK SOLUTIONS PTE LTD·Filed 2006·Application pending·0 cites
- 4439US2008248610A1Thermal bonding process for chip packagingADVANPACK SOLUTIONS PTE LTD·Filed 2007·Application pending·0 cites
- 4538US2007196979A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTIONS PTE LTD·Filed 2006·Application pending·0 cites
- 4636US2006103016A1Heat sinking structureADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 4734US8791583B2Apparatus for molding a semiconductor wafer and process thereforCHEW HWEE SENG JIMMY·Filed 2002·Granted Jul 29, 2014·0 cites·26 claims
- 4831US5085321ACarrier for an integrated circuit packageMICROFITS & METHODS PTE LTD·Filed 1990·Granted Feb 4, 1992·6 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →