Inventor · disambiguated record
Misao Umematsu
Also filed as: UMEMATSU MISAO
10 granted patents·6 pending applications·136 citations·filing 1993–2018
88Inventor score
Top patents by PatentIndex Score
16 records- 0192US6399897B1Multi-layer wiring substrateFUJITSU LTD·Filed 2000·Granted Jun 4, 2002·63 cites·6 claims
- 0285US10362704B2Information processing apparatusFUJITSU LTD·Filed 2018·Granted Jul 23, 2019·8 cites·13 claims
- 0378US5437558AConnector having skirt with holes to receive plug pins and alignment pinFUJITSU LTD·Filed 1993·Granted Aug 1, 1995·46 cites·9 claims
- 0476US10154609B2Cable unit and server apparatusFUJITSU LTD·Filed 2017·Granted Dec 11, 2018·2 cites·11 claims
- 0566US7268002B2Packaging method, packaging structure and package substrate for electronic partsFUJITSU LTD·Filed 2005·Granted Sep 11, 2007·3 cites·9 claims
- 0664US8780554B2Electronic deviceUMEMATSU MISAO·Filed 2012·Granted Jul 15, 2014·2 cites·9 claims
- 0762US9733433B2Optical connection boxFUJIKURA LTD·Filed 2014·Granted Aug 15, 2017·1 cites·13 claims
- 0857US2014071631A1Printed circuit board unitFUJITSU LTD·Filed 2013·Application pending·0 cites
- 0951US2015109731A1Electronic deviceFUJITSU LTD·Filed 2014·Application pending·0 cites
- 1050US2015009620A1Electronic apparatusFUJITSU LTD·Filed 2014·Application pending·0 cites
- 1150US2010226102A1Printed circuit board unitFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1249US7291901B2Packaging method, packaging structure and package substrate for electronic partsFUJITSU LTD·Filed 2004·Granted Nov 6, 2007·3 cites·9 claims
- 1347US2015059388A1Information processing apparatusFUJITSU LTD·Filed 2014·Application pending·0 cites
- 1445US6891247B2Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bondingFUJITSU LTD·Filed 2002·Granted May 10, 2005·6 cites·7 claims
- 1543US6465085B1Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the sameFUJITSU LTD·Filed 2000·Granted Oct 15, 2002·2 cites·20 claims
- 1643US2015036272A1Electronic device and substrate unitFUJITSU LTD·Filed 2014·Application pending·0 cites
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