Inventor · disambiguated record
Sheng-Yi Su
Also filed as: SU SHENG-YI
3 granted patents·1 pending application·1 citations·filing 2017–2018
50Inventor score
Files withUNITED MICROELECTRONICS CORP4
Top patents by PatentIndex Score
4 records- 0166US10153231B2Interconnect structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·1 cites·14 claims
- 0249US10446489B2Interconnect structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·0 cites·8 claims
- 0342US10079177B1Method for forming copper material over substrateUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 18, 2018·0 cites·18 claims
- 0437US2020168450A1Method for fabricating interconnect of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →