Inventor · disambiguated record
Markus Youkhanis
Also filed as: YOUKHANIS MARKUS
4 granted patents·7 citations·filing 2005–2020
63Inventor score
Top patents by PatentIndex Score
4 records- 0178US8784634B2Electrolytic method for filling holes and cavities with metalsREENTS BERT·Filed 2007·Granted Jul 22, 2014·5 cites·25 claims
- 0272US9445510B2Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copperREENTS BERT·Filed 2005·Granted Sep 13, 2016·2 cites·22 claims
- 0347US9526183B2Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copperATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Dec 20, 2016·0 cites·20 claims
- 0441US12063751B2Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit boardATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Aug 13, 2024·0 cites·19 claims
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