Inventor · disambiguated record
Hui-Shan Chang
Also filed as: CHANG HUI-SHAN
11 granted patents·8 pending applications·162 citations·filing 2008–2024
88Inventor score
Top patents by PatentIndex Score
19 records- 0195US7791211B2Flip chip package structure and carrier thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Sep 7, 2010·75 cites·8 claims
- 0293US8076765B2Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductorsCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 13, 2011·52 cites·25 claims
- 0390US8446000B2Package structure and package processSHEN CHI-CHIH·Filed 2010·Granted May 21, 2013·19 cites·23 claims
- 0488US8258007B2Package processSHEN CHI-CHIH·Filed 2010·Granted Sep 4, 2012·10 cites·7 claims
- 0576US2025060851A1Electronic device having a biometric input system including a composite cover elementAPPLE INC·Filed 2024·Application pending·0 cites
- 0674US12135855B2Electronic device having a biometric input system including a composite cover elementAPPLE INC·Filed 2023·Granted Nov 5, 2024·0 cites·20 claims
- 0769US12415952B2Carbon nanodot-polyacrylic acid composite hydrogel, and method for preparing and formulation for forming the sameUNIV SOUTHERN TAIWAN SCI & TEC·Filed 2022·Granted Sep 16, 2025·0 cites·9 claims
- 0860US8105877B2Method of fabricating a stacked type chip package structureSHEN CHI-CHIH·Filed 2008·Granted Jan 31, 2012·2 cites·14 claims
- 0959US8643167B2Semiconductor package with through silicon vias and method for making the sameHUNG CHIA-LIN·Filed 2011·Granted Feb 4, 2014·2 cites·20 claims
- 1058US8952542B2Method for dicing a semiconductor wafer having through silicon vias and resultant structuresADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Feb 10, 2015·2 cites·20 claims
- 1147US2012205800A1Packaging structureSHEN CHI-CHIH·Filed 2012·Application pending·0 cites
- 1245US2009127706A1Chip structure, substrate structure, chip package structure and process thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1344US2012049338A1Stackable semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Application pending·0 cites
- 1438US2012049332A1Semiconductor package and method for manufacturing the sameCHEN JEN-CHUAN·Filed 2011·Application pending·0 cites
- 1537US8390129B2Semiconductor device with a plurality of mark through substrate viasSHEN CHI-CHIH·Filed 2010·Granted Mar 5, 2013·0 cites·18 claims
- 1635US2012086120A1Stacked semiconductor package having conductive vias and method for making the sameCHEN JEN-CHUAN·Filed 2011·Application pending·0 cites
- 1734US2011300669A1Method for Making Die AssembliesSHEN CHI-CHIH·Filed 2010·Application pending·0 cites
- 1832US2013175324A1Thermal compression head for flip chip bondingCHANG HUI-SHAN·Filed 2012·Application pending·0 cites
- 1930US11684545B2Hearing training deviceEYESON TECH CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →