Inventor · disambiguated record
Hideharu Itatani
Also filed as: ITATANI HIDEHARU
32 granted patents·19 pending applications·600 citations·filing 1997–2025
96Inventor score
Files withHITACHI INT ELECTRIC INC30KOKUSAI ELECTRIC CORP13HARADA KAZUHIRO2HORII SADAYOSHI1OGAWA ARITO1
Top patents by PatentIndex Score
51 records- 0198US6682971B2Method of manufacturing a semiconductorHITACHI INT ELECTRIC INC·Filed 2001·Granted Jan 27, 2004·467 cites·7 claims
- 0297US11322370B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted May 3, 2022·3 cites·20 claims
- 0396US11728183B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 15, 2023·2 cites·20 claims
- 0495US8235001B2Substrate processing apparatus and method for manufacturing semiconductor deviceSANO ATSUSHI·Filed 2008·Granted Aug 7, 2012·30 cites·14 claims
- 0594US7648578B1Substrate processing apparatus, and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Jan 19, 2010·30 cites·17 claims
- 0691US8367566B2Method for manufacturing semiconductor device and method for processing substrateHITACHI INT ELECTRIC INC·Filed 2012·Granted Feb 5, 2013·5 cites·6 claims
- 0785US8404603B2Method of manufacturing semiconductor device and substrate processing systemOGAWA ARITO·Filed 2010·Granted Mar 26, 2013·8 cites·20 claims
- 0884US8420552B2Method of manufacturing a semiconductor deviceTAKEBAYASHI YUJI·Filed 2010·Granted Apr 16, 2013·6 cites·2 claims
- 0982US12224185B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 1080US9472637B2Semiconductor device having electrode made of high work function material and method of manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 18, 2016·3 cites·17 claims
- 1179US7579276B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Aug 25, 2009·3 cites·13 claims
- 1278US7968437B2Semiconductor device manufacturing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2006·Granted Jun 28, 2011·6 cites·16 claims
- 1376US10388530B2Method of manufacturing semiconductor device and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 20, 2019·1 cites·14 claims
- 1476US9523150B2Substrate processing apparatus, method for manufacturing semiconductor device and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Dec 20, 2016·3 cites·8 claims
- 1575US9218993B2Method of manufacturing semiconductor device and method of processing substrateHARADA KAZUHIRO·Filed 2011·Granted Dec 22, 2015·1 cites·14 claims
- 1673US2025230542A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1772US8435905B2Manufacturing method of semiconductor device, and substrate processing apparatusHORII SADAYOSHI·Filed 2006·Granted May 7, 2013·4 cites·13 claims
- 1869US7531467B2Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2005·Granted May 12, 2009·3 cites·3 claims
- 1968US9786493B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 10, 2017·2 cites·6 claims
- 2066US9437704B2Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 6, 2016·1 cites·11 claims
- 2165US8741731B2Method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 3, 2014·1 cites·17 claims
- 2264US8728935B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHARADA KAZUHIRO·Filed 2010·Granted May 20, 2014·2 cites·8 claims
- 2364US2025105008A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2463US10604839B2Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 31, 2020·1 cites·8 claims
- 2562US7723245B2Method for manufacturing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2005·Granted May 25, 2010·1 cites·8 claims
- 2661US2024249962A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2761US2024360552A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2858US6576481B2Method of manufacturing semiconductor devicesHITACHI INT ELECTRIC INC·Filed 2001·Granted Jun 10, 2003·6 cites·5 claims
- 2957US7709276B2Manufacturing method of a semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Granted May 4, 2010·1 cites·8 claims
- 3056US9653301B2Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2016·Granted May 16, 2017·0 cites·11 claims
- 3156US2018247819A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 3254US2023085140A1Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3351US2022298642A1Substrate Processing Apparatus and Method of Manufacturing Semiconductor DeviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3449US10340237B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 2, 2019·0 cites·20 claims
- 3549US2015325447A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 3648US10714316B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jul 14, 2020·0 cites·19 claims
- 3747US7524766B2Method for manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Apr 28, 2009·3 cites·3 claims
- 3846US2011163452A1Semiconductor device, method of manufacturing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
- 3946US2021189557A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 4043US2016237568A1Substrate processing apparatus and non-transitory computer readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 4142US2020051838A1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 4241US2013075800A1Semiconductor device manufacturing method, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 4339US6306183B1Method of forming manufacturing semiconductor deviceSONY CORP·Filed 1997·Granted Oct 23, 2001·6 cites·2 claims
- 4437US2011104896A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 4536US2010291763A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 4635US6548404B2Method and apparatus for manufacturing semiconductor devicesHITACHI INT ELECTRIC INC·Filed 2001·Granted Apr 15, 2003·0 cites·20 claims
- 4735US2003045094A1Method and apparatus for manufacturing semiconductor devicesHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
- 4834US2003054636A1Method for manufacturing a semiconductor device and method for processing substrateHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
- 4933US2001002585A1Apparatus for producing a semiconductor deviceFiled 2000·Application pending·0 cites
- 5033US2015252474A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →