Inventor · disambiguated record

Sadayoshi Horii

Also filed as: HORII SADAYOSHI

28 granted patents·13 pending applications·144 citations·filing 2003–2023

95Inventor score

Technology areasH10P H10D C23C

Files withHITACHI INT ELECTRIC INC22 KOKUSAI ELECTRIC CORP7 HORII SADAYOSHI6 HARADA KAZUHIRO1 HITACHI KOKUSAI ELECTRONIC INC1

Top patents by PatentIndex Score

41 records

0194US7648578B1Substrate processing apparatus, and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Jan 19, 2010·30 cites·17 claims
0293US11869764B2Substrate processing apparatus, substrate processing method and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 9, 2024·1 cites·15 claims
0392US11476112B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Oct 18, 2022·6 cites·10 claims
0490US8026159B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Granted Sep 27, 2011·17 cites·8 claims
0585US8404603B2Method of manufacturing semiconductor device and substrate processing systemOGAWA ARITO·Filed 2010·Granted Mar 26, 2013·8 cites·20 claims
0684US8420552B2Method of manufacturing a semiconductor deviceTAKEBAYASHI YUJI·Filed 2010·Granted Apr 16, 2013·6 cites·2 claims
0782US12368043B2Substrate processing apparatus, processing method, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jul 22, 2025·0 cites·19 claims
0882US6787481B2Method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2003·Granted Sep 7, 2004·29 cites·17 claims
0980US9472637B2Semiconductor device having electrode made of high work function material and method of manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 18, 2016·3 cites·17 claims
1079US7579276B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Aug 25, 2009·3 cites·13 claims
1178US7968437B2Semiconductor device manufacturing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2006·Granted Jun 28, 2011·6 cites·16 claims
1274US8415237B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2011·Granted Apr 9, 2013·3 cites·14 claims
1372US10985017B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 20, 2021·1 cites·15 claims
1472US8435905B2Manufacturing method of semiconductor device, and substrate processing apparatusHORII SADAYOSHI·Filed 2006·Granted May 7, 2013·4 cites·13 claims
1570US6825126B2Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Nov 30, 2004·11 cites·20 claims
1669US12087598B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 10, 2024·1 cites·17 claims
1769US7531467B2Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2005·Granted May 12, 2009·3 cites·3 claims
1866US9437704B2Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 6, 2016·1 cites·11 claims
1965US8741731B2Method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 3, 2014·1 cites·17 claims
2064US8728935B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHARADA KAZUHIRO·Filed 2010·Granted May 20, 2014·2 cites·8 claims
2163US10604839B2Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 31, 2020·1 cites·8 claims
2262US7723245B2Method for manufacturing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2005·Granted May 25, 2010·1 cites·8 claims
2361US8685866B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2010·Granted Apr 1, 2014·1 cites·10 claims
2460US8580671B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2012·Granted Nov 12, 2013·1 cites·12 claims
2558US8193083B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2008·Granted Jun 5, 2012·1 cites·8 claims
2656US9653301B2Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2016·Granted May 16, 2017·0 cites·11 claims
2756US2023294145A1Gas cleaning method, method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
2853US2023227979A1Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
2950US11168396B2Method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 9, 2021·0 cites·13 claims
3047US7524766B2Method for manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Apr 28, 2009·3 cites·3 claims
3147US2008286075A1Method for producing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
3246US2011163452A1Semiconductor device, method of manufacturing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
3343US2009233429A1Semiconductor device manufacturing method and substrate processing apparatusISHIKAWA DAI·Filed 2007·Application pending·0 cites
3442US2006035470A1Method for manufaturing semiconductor device and substrate processing systemHITACHI KOKUSAI ELECTRONIC INC·Filed 2003·Application pending·0 cites
3542US2009209095A1Manufacturing Method for Semiconductor Devices and Substrate Processing ApparatusHORII SADAYOSHI·Filed 2006·Application pending·0 cites
3641US2013075800A1Semiconductor device manufacturing method, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
3740US2019003047A1Vaporizer and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
3838US2007087579A1Semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2005·Application pending·0 cites
3937US2006240677A1Method for manufacturing semiconductor device and substrate processing apparatusSUSUMU HORITA·Filed 2003·Application pending·0 cites
4037US2011104896A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
4136US2010291763A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites

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