Inventor · disambiguated record
Yao-Wen Bai
Also filed as: BAI YAO-WEN
10 granted patents·9 pending applications·24 citations·filing 2008–2012
83Inventor score
Files withFUKUI PREC COMPONENT SHENZHEN7BAI YAO-WEN4LIN CHENG-HSIEN3UNIV TSINGHUA2HONG HENG SHENG ELECTRICAL TECHNOLOGY HUAIAN CO LTD1
Top patents by PatentIndex Score
19 records- 0186US8211267B2Electromagnetic shielding composite and method for making the sameLIN CHENG-HSIEN·Filed 2008·Granted Jul 3, 2012·15 cites·14 claims
- 0269US8388800B2Apparatus for wet processing substrateBAI YAO-WEN·Filed 2010·Granted Mar 5, 2013·3 cites·14 claims
- 0364US8440158B2Pre-plating solutions for making printed circuit boards and methods for preparing the sameLIN CHENG-HSIEN·Filed 2008·Granted May 14, 2013·2 cites·11 claims
- 0462US8475867B2Method for forming electrical traces on substrateBAI YAO-WEN·Filed 2009·Granted Jul 2, 2013·2 cites·13 claims
- 0557US2009301763A1Ink, method of forming electrical traces using the same and circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 0656US7998332B2Electroplating methodFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Aug 16, 2011·0 cites·8 claims
- 0755US8377317B2Method for manufacturing printed circuit board with thick tracesHONG HENG SHENG ELECTRICAL TECHNOLOGY HUAIAN CO LTD·Filed 2010·Granted Feb 19, 2013·1 cites·14 claims
- 0854US9398733B2Electromagnetic shielding compositeLIN CHENG-HSIEN·Filed 2012·Granted Jul 19, 2016·0 cites·5 claims
- 0954US2009291230A1Ink and method of forming electrical traces using the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2009·Application pending·0 cites
- 1053US8071887B2Printed circuit board and method for manufacturing sameLIOU SHING-TZA·Filed 2008·Granted Dec 6, 2011·1 cites·14 claims
- 1153US2010173095A1Inkjet ink and method for making conductive wires using the sameUNIV TSINGHUA·Filed 2009·Application pending·0 cites
- 1251US9247650B2Method for making conductive wiresBAI YAO-WEN·Filed 2009·Granted Jan 26, 2016·0 cites·4 claims
- 1351US2009286006A1Ink and method of forming electrical traces using the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1450US2010021652A1Method of forming electrical tracesFUKUI PREC COMPONENT SHENZHEN·Filed 2009·Application pending·0 cites
- 1547US2010255290A1Carbon nanotube metal nanoparticle composite and method for making the sameUNIV TSINGHUA·Filed 2009·Application pending·0 cites
- 1645US2010021653A1Method of forming electrical traces on substrateFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1743US2009304911A1Method of forming circuits on circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1841US8685202B2Etching device and method for manufacturing printed circuit board using sameBAI YAO-WEN·Filed 2011·Granted Apr 1, 2014·0 cites·18 claims
- 1937US2011186339A1Printed circuit board with carbon nanotube bundleHONG HENG SHENG ELECTRONICAL TECHNOLOGY HUAIAN CO LTD·Filed 2010·Application pending·0 cites
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