Inventor · disambiguated record
Robert K. Lowry
Also filed as: LOWRY ROBERT K
19 granted patents·1 pending application·926 citations·filing 1979–2011
96Inventor score
Top patents by PatentIndex Score
20 records- 0196US5569620ABonded wafer processing with metal silicidationHARRIS CORP·Filed 1994·Granted Oct 29, 1996·194 cites·13 claims
- 0294US5849627ABonded wafer processing with oxidative bondingHARRIS CORP·Filed 1995·Granted Dec 15, 1998·178 cites·5 claims
- 0394US5387555ABonded wafer processing with metal silicidationHARRIS CORP·Filed 1992·Granted Feb 7, 1995·149 cites·8 claims
- 0489US6335208B1Laser decapsulation methodINTERSIL INC·Filed 1999·Granted Jan 1, 2002·69 cites·2 claims
- 0589US5362667ABonded wafer processingHARRIS CORP·Filed 1992·Granted Nov 8, 1994·93 cites·26 claims
- 0688US7316936B2Laser decapsulation methodINTERSIL AMERICANS INC·Filed 2006·Granted Jan 8, 2008·10 cites·18 claims
- 0786US4272986AMethod and means for measuring moisture content of hermetic semiconductor devicesHARRIS CORP·Filed 1979·Granted Jun 16, 1981·38 cites·23 claims
- 0880US5728624ABonded wafer processingHARRIS CORP·Filed 1995·Granted Mar 17, 1998·52 cites·11 claims
- 0980US5517047ABonded wafer processingHARRIS CORP·Filed 1994·Granted May 14, 1996·53 cites·5 claims
- 1078US7166186B2Laser decapsulation apparatus and methodINTERSIL INC·Filed 2001·Granted Jan 23, 2007·14 cites·1 claims
- 1170USRE43980ELaser decapsulation methodINTERSIL CORP·Filed 2011·Granted Feb 5, 2013·1 cites·25 claims
- 1267USRE42193ELaser decapsulation methodINTERSIL CORP·Filed 2009·Granted Mar 1, 2011·1 cites·28 claims
- 1362US6909146B1Bonded wafer with metal silicidationINTERSIL CORP·Filed 1999·Granted Jun 21, 2005·25 cites·6 claims
- 1454US5808353ARadiation hardened dielectric for EEPROMHARRIS CORP·Filed 1996·Granted Sep 15, 1998·13 cites·15 claims
- 1545US6054012ADecapsulating method and apparatus for integrated circuit packagesINTERSIL CORP·Filed 1998·Granted Apr 25, 2000·9 cites·32 claims
- 1645US4781853AMethod of enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ionsHARRIS CORP·Filed 1986·Granted Nov 1, 1988·9 cites·6 claims
- 1742US2010004583A1Hydrophobic Circuit Board Coating of Electrotransport Drug Delivery DevicesALZA CORP·Filed 2009·Application pending·0 cites
- 1840US4859280AMethod of etching silicon by enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ionsHARRIS CORP·Filed 1988·Granted Aug 22, 1989·7 cites·7 claims
- 1939US6130172ARadiation hardened dielectric for EEPROMINTERSIL CORP·Filed 1998·Granted Oct 10, 2000·7 cites·12 claims
- 2035US6457506B1Decapsulating method and apparatus for integrated circuit packagesINTERSIL INC·Filed 1999·Granted Oct 1, 2002·4 cites·6 claims
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