Inventor · disambiguated record
Ying-Che Sung
Also filed as: SUNG YING-CHE
5 granted patents·9 pending applications·65 citations·filing 2000–2022
77Inventor score
Top patents by PatentIndex Score
14 records- 0178US6344665B1Electrode structure of compound semiconductor deviceARIMA OPTOELECTRONICS CORP·Filed 2000·Granted Feb 5, 2002·52 cites·2 claims
- 0271US7781755B2Light emitting diode by use of metal diffusion bonding technology and method of producing such light emitting diodeARIMA OPTOELECTRONICS CORP·Filed 2009·Granted Aug 24, 2010·5 cites·9 claims
- 0370US7704770B2Light emitting diode by use of metal diffusion bonding technology and method of producing light emitting diodeARIMA OPTOELECTRONICS CORP·Filed 2006·Granted Apr 27, 2010·5 cites·10 claims
- 0453US2023151984A1Electrostatic dust collection apparatus and air purifier comprising such electrostatic dust collection apparatusRICE EAR LTD·Filed 2022·Application pending·0 cites
- 0544US6303485B1Method of producing gallium nitride-based III-V Group compound semiconductor deviceARIMA OPTOELECTRONICS CORP·Filed 2000·Granted Oct 16, 2001·3 cites·6 claims
- 0638US2020269255A1Air purifier and improvement of air-purifying performanceRICE EAR LTD·Filed 2020·Application pending·0 cites
- 0738US2005244992A1Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereofARIMA OPTOELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 0836US8841694B2LED module with separate heat-dissipation and electrical conduction paths, and related heat dissipation boardLITUP TECHNOLOGY CO LTD·Filed 2013·Granted Sep 23, 2014·0 cites·21 claims
- 0935US2005173710A1Method for manufacturing light emitting diode utilizing transparent substrate and metal bonding technology and structure thereofFiled 2005·Application pending·0 cites
- 1033US2004206963A1Method for manufacturing light emitting diode utilizing transparent substrate and metal bonding technology and structure thereofARIMA OPTOELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 1133US2005072983A1Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereofARIMA OPTOELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 1233US2004004225A1Light emitting diode and manufacturing method thereofARIMA OPTOELECTRONICS CORP·Filed 2002·Application pending·0 cites
- 1327US2005082547A1Light emitting device having a transparent conducting layerFiled 2004·Application pending·0 cites
- 1421US2005082556A1InGaN-based ledFiled 2004·Application pending·0 cites
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