Inventor · disambiguated record
Licheng M. Han
Also filed as: HAN LICHENG · HAN LICHENG M · HAN LICHENG MARSHAL
9 granted patents·3 pending applications·231 citations·filing 1999–2019
89Inventor score
Top patents by PatentIndex Score
12 records- 0194US6424044B1Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallizationCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Jul 23, 2002·99 cites·13 claims
- 0291US6352921B1Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallizationCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Mar 5, 2002·64 cites·20 claims
- 0389US9502365B2Opening in a multilayer polymeric dielectric layer without delaminationTEXAS INSTRUMENTS INC·Filed 2014·Granted Nov 22, 2016·14 cites·17 claims
- 0480US10251280B2Integrated circuit with micro inductor and micro transformer with magnetic coreTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 2, 2019·3 cites·4 claims
- 0569US6429129B1Method of using silicon rich carbide as a barrier material for fluorinated materialsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Aug 6, 2002·11 cites·21 claims
- 0668US6214423B1Method of forming a polymer on a surfaceTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 10, 2001·34 cites·4 claims
- 0767US10349526B2Integrated circuit with micro inductor and micro transformer with magnetic coreTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 9, 2019·0 cites·20 claims
- 0860US6730591B2Method of using silicon rich carbide as a barrier material for fluorinated materialsCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted May 4, 2004·6 cites·27 claims
- 0949US10546821B2Opening in a multilayer polymeric dielectric layer without delaminationTEXAS INSTRUMENTS INC·Filed 2016·Granted Jan 28, 2020·0 cites·23 claims
- 1038US2012211884A1Wafer chip scale package connection schemeSTEPNIAK FRANK·Filed 2011·Application pending·0 cites
- 1138US2013193569A1Integrated Circuit Die And Method Of FabricatingHAN LICHENG MARSHAL·Filed 2012·Application pending·0 cites
- 1237US2004185678A1Integrated circuit dielectric and methodFiled 2003·Application pending·0 cites
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