Inventor · disambiguated record
Frank E. Andros
Also filed as: ANDROS FRANK E · ANDROS FRANK EDWARD
10 granted patents·546 citations·filing 1979–1999
92Inventor score
Files withIBM10
Top patents by PatentIndex Score
10 records- 0190US5519936AMethod of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded theretoIBM·Filed 1995·Granted May 28, 1996·113 cites·9 claims
- 0287US5367435AElectronic package structure and method of making sameIBM·Filed 1993·Granted Nov 22, 1994·106 cites·10 claims
- 0386US6219238B1Structure for removably attaching a heat sink to surface mount packagesIBM·Filed 1999·Granted Apr 17, 2001·61 cites·15 claims
- 0482US5561323AElectronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded theretoIBM·Filed 1995·Granted Oct 1, 1996·67 cites·26 claims
- 0580US5773884AElectronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded theretoIBM·Filed 1997·Granted Jun 30, 1998·67 cites·16 claims
- 0677US5633533AElectronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded theretoIBM·Filed 1996·Granted May 27, 1997·58 cites·26 claims
- 0770US4313492AMicro helix thermo capsuleIBM·Filed 1979·Granted Feb 2, 1982·28 cites·6 claims
- 0863US4291364AAir-cooled hybrid electronic packageIBM·Filed 1979·Granted Sep 22, 1981·24 cites·4 claims
- 0956US4212349AMicro bellows thermo capsuleIBM·Filed 1979·Granted Jul 15, 1980·17 cites·9 claims
- 1035US6060341AMethod of making an electronic packageIBM·Filed 1998·Granted May 9, 2000·5 cites·18 claims
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