Inventor · disambiguated record
Kenneth Newton
Also filed as: NEWTON KENNETH J · NEWTON KENNETH JOSEPH
9 granted patents·2 pending applications·187 citations·filing 2000–2006
88Inventor score
Files withTEXAS INSTRUMENTS INC9
Top patents by PatentIndex Score
11 records- 0193US6455411B1Defect and etch rate control in trench etch for dual damascene patterning of low-k dielectricsTEXAS INSTRUMENTS INC·Filed 2001·Granted Sep 24, 2002·86 cites·18 claims
- 0289US6720247B2Pre-pattern surface modification for low-k dielectrics using A H2 plasmaTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 13, 2004·48 cites·11 claims
- 0381US6797633B2In-situ plasma ash/treatment after via etch of low-k films for poison-free dual damascene trench patterningTEXAS INSTRUMENTS INC·Filed 2001·Granted Sep 28, 2004·27 cites·15 claims
- 0467US6774031B2Method of forming dual-damascene structureTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 10, 2004·14 cites·9 claims
- 0558US7727885B2Reduction of punch-thru defects in damascene processingTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 1, 2010·1 cites·23 claims
- 0656US6723636B1Methods for forming multiple damascene layersTEXAS INSTRUMENTS INC·Filed 2003·Granted Apr 20, 2004·7 cites·4 claims
- 0746US6861348B2Pre-pattern surface modification of low-k dielectricsTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 1, 2005·1 cites·16 claims
- 0845US6872665B1Process flow for dual damescene interconnect structuresTEXAS INSTRUMENTS INC·Filed 2000·Granted Mar 29, 2005·3 cites·8 claims
- 0942US7087518B2Method of passivating and/or removing contaminants on a low-k dielectric/copper surfaceTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 8, 2006·0 cites·7 claims
- 1039US2003170992A1Method of passivating and/or removing contaminants on a low-k dielectric/copper surfaceFiled 2002·Application pending·0 cites
- 1131US2003181034A1Methods for forming vias and trenches with controlled SiC etch rate and selectivityFiled 2002·Application pending·0 cites
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