Inventor · disambiguated record
Motoji Suzuki
Also filed as: SUZUKI MOTOJI
12 granted patents·2 pending applications·227 citations·filing 1979–2002
91Inventor score
Top patents by PatentIndex Score
14 records- 0181US6049038AFlip-chip resin sealing structure and resin sealing methodNEC CORP·Filed 1998·Granted Apr 11, 2000·66 cites·9 claims
- 0277US5939626ATire pressure detecting device which compares driven and driving wheel speeds and acceleration wherein judgment is prohibited when slippage occursNIPPON SOKEN·Filed 1997·Granted Aug 17, 1999·40 cites·5 claims
- 0372US6857361B2Method and apparatus for printing solder paste of different thickness on lands on printed circuit boardNEC CORP·Filed 2002·Granted Feb 22, 2005·16 cites·10 claims
- 0470US5925445APrinted wiring boardNEC CORP·Filed 1997·Granted Jul 20, 1999·39 cites·16 claims
- 0562US4609841AThree-rotary position control deviceNIPPON DENSO CO·Filed 1985·Granted Sep 2, 1986·17 cites·7 claims
- 0657US6617529B2Circuit board and electronic equipment using the sameNEC CORP·Filed 2001·Granted Sep 9, 2003·8 cites·7 claims
- 0757US5668058AMethod of producing a flip chipNEC CORP·Filed 1995·Granted Sep 16, 1997·23 cites·24 claims
- 0851US7057293B2Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the sameNEC CORP·Filed 2002·Granted Jun 6, 2006·3 cites·6 claims
- 0951US4252351ALocking and unlocking deviceNIPPON DENSO CO·Filed 1979·Granted Feb 24, 1981·14 cites·8 claims
- 1046US6929973B2Method of packaging electronic components with high reliabilityNEC CORP·Filed 2002·Granted Aug 16, 2005·1 cites·7 claims
- 1139US7013557B2Method of packaging electronic components without creating unnecessary solder ballsNEC CORP·Filed 2002·Granted Mar 21, 2006·0 cites·4 claims
- 1239US6915942B2Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloyNEC CORP·Filed 2002·Granted Jul 12, 2005·0 cites·11 claims
- 1339US2002179695A1Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formedFiled 2002·Application pending·0 cites
- 1439US2002179328A1Method of mounting electronic parts with Sn-Zn solder free of Pb without reduction in bonding strengthNEC CORP·Filed 2002·Application pending·0 cites
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