Inventor · disambiguated record
Naoyuki Jimbo
Also filed as: JIMBO NAOYUKI
4 granted patents·9 pending applications·33 citations·filing 2000–2022
72Inventor score
Top patents by PatentIndex Score
13 records- 0179US7040963B1Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferIBIDEN CO LTD·Filed 2000·Granted May 9, 2006·19 cites·37 claims
- 0274US6475068B1Wafer holding plate for wafer grinding apparatus and method for manufacturing the sameIBIDEN CO LTD·Filed 2000·Granted Nov 5, 2002·14 cites·6 claims
- 0366US2025149684A1Heat transfer suppression sheet and battery packIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 0466US2025140987A1Heat insulation sheet and battery packIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 0564US2025062445A1Heat transfer suppression sheet and battery packIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 0655US2025070319A1Heat transfer suppression sheet and battery packIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 0754US2025055077A1Heat transfer suppression sheet, production method therefor, and battery packIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 0854US2025070350A1Heat transfer suppression sheet and battery packIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 0947US2024339698A1Thermal insulation sheet, method for producing thermal insulation sheet, and battery packIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 1045US7029379B2Wafer holding plate for wafer grinding apparatus and method for manufacturing the sameIBIDEN CO LTD·Filed 2005·Granted Apr 18, 2006·0 cites·12 claims
- 1144US2005260938A1Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferOKUDA YUJI·Filed 2005·Application pending·0 cites
- 1239US2005260930A1Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferOKUDA YUJI·Filed 2005·Application pending·0 cites
- 1337US6916228B2Wafer holding plate for wafer grinding apparatus and method for manufacturing the sameIBIDEN CO LTD·Filed 2002·Granted Jul 12, 2005·0 cites·14 claims
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