Inventor · disambiguated record

Je Bong Kang

Also filed as: KANG JE BONG

3 granted patents·75 citations·filing 1996–2000

72Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD3

Top patents by PatentIndex Score

3 records

0169US6031281ASemiconductor integrated circuit device having dummy bonding wiresSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 29, 2000·52 cites·10 claims
0251US6407446B2Leadframe and semiconductor chip package having cutout portions and increased lead countSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 18, 2002·5 cites·20 claims
0346US5923092AWiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frameSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jul 13, 1999·18 cites·4 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →