Inventor · disambiguated record
Kok Chuen Lock
Also filed as: LOCK KOK CHUEN
2 granted patents·1 citations·filing 2020–2021
30Inventor score
Technology areasH10W
Files withUTAC HEADQUARTERS PTE LTD2
Top patents by PatentIndex Score
2 records- 0176US11227818B2Stacked dies electrically connected to a package substrate by lead terminalsUTAC HEADQUARTERS PTE LTD·Filed 2020·Granted Jan 18, 2022·1 cites·19 claims
- 0249US11901308B2Semiconductor packages with integrated shieldingUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →