Inventor · disambiguated record
Keisuke Kushida
Also filed as: KUSHIDA KEISUKE
4 granted patents·2 pending applications·0 citations·filing 2016–2020
53Inventor score
Top patents by PatentIndex Score
6 records- 0162US11691389B2Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 4, 2023·0 cites·13 claims
- 0259US10940674B2Resin varnish, prepreg, laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 9, 2021·0 cites·16 claims
- 0354US2019161586A1Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0446US2021015208A1Sole structure and shoes using sameMIZUNO KK·Filed 2019·Application pending·0 cites
- 0544US11136454B2Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Oct 5, 2021·0 cites·15 claims
- 0638US12258468B2Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2019·Granted Mar 25, 2025·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →