Inventor · disambiguated record
Paul Howard Mazurkiewicz
Also filed as: MAZURKIEWICZ PAUL · MAZURKIEWICZ PAUL H · MAZURKIEWICZ PAUL HOWARD
22 granted patents·8 pending applications·352 citations·filing 2001–2024
95Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO25AMAZON TECH INC1BABB SAMUEL M1HEWLETT PACKARD DEVELOPMENT CO LP1
Top patents by PatentIndex Score
30 records- 0195US6900383B2Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfacesHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted May 31, 2005·91 cites·26 claims
- 0293US6849800B2Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coatingHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Feb 1, 2005·56 cites·58 claims
- 0392US8156644B2Method for manufacturing a printed circuit board having conformal EMI shieldBABB SAMUEL M·Filed 2006·Granted Apr 17, 2012·24 cites·11 claims
- 0491US7196275B2EMI shield that adheres to and conforms with printed circuit board surfacesHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Mar 27, 2007·45 cites·24 claims
- 0589US7214889B2Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coatingHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 8, 2007·35 cites·36 claims
- 0688US6596937B2Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coatingHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jul 22, 2003·35 cites·15 claims
- 0786US6600101B2Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coatingHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jul 29, 2003·28 cites·13 claims
- 0885US6626684B1Nanotube socket system and methodHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 30, 2003·35 cites·37 claims
- 0976US10521711B1Controllable read blocking based radio-frequency identificationHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Dec 31, 2019·2 cites·15 claims
- 1067US10585454B2Outer cases for computing devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Mar 10, 2020·1 cites·20 claims
- 1161US2025311152A1Cooling plate having reconfigurable ferrofluid-based channelsAMAZON TECH INC·Filed 2024·Application pending·0 cites
- 1257US11836304B2Digital pen sensor surfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Dec 5, 2023·0 cites·15 claims
- 1353US11119545B2Filter mesh with incorporated strain gaugeHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Sep 14, 2021·0 cites·13 claims
- 1453US10713548B2Marker with informationHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jul 14, 2020·0 cites·16 claims
- 1552US11430367B2Displays with phosphorescent componentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Aug 30, 2022·0 cites·15 claims
- 1651US11423277B2Fluidic conductive trace based radio-frequency identificationHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Aug 23, 2022·0 cites·15 claims
- 1751US11231687B2Isotope detecting devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jan 25, 2022·0 cites·11 claims
- 1851US10679587B2Display of supplemental informationHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jun 9, 2020·0 cites·20 claims
- 1951US2022175996A1Autoclavable human interface deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 2050US11636278B2X-ray powered data transmissionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 25, 2023·0 cites·15 claims
- 2150US11331614B2Thermally conductive particulate sensorHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted May 17, 2022·0 cites·15 claims
- 2246US10837924B2Encoding information in chemical concentrationsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Nov 17, 2020·0 cites·17 claims
- 2346US2025022312A1Identification of Facial Expression of Head-Mountable Display WearerHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 2443US2020001306A1Filter assembly with charge electrodesHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 2542US9625436B2Determining the geographic origin of metalsHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Apr 18, 2017·0 cites·20 claims
- 2639US10380792B2Three-dimensional model generationHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Aug 13, 2019·0 cites·18 claims
- 2739US2005095410A1Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coatingFiled 2004·Application pending·0 cites
- 2838US2021223825A1Computing device modulesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 2937US2019262750A1Filter measurementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Application pending·0 cites
- 3037US2002129971A1Filler material and pretreatment of printed circuit board components to facilitate application of a conformal EMI shieldFiled 2001·Application pending·0 cites
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