Inventor · disambiguated record
Chang Ying Hung
Also filed as: HUNG CHANG-YING
5 granted patents·1 pending application·42 citations·filing 2009–2011
75Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG2CHANG HSIAO-CHUAN1CHENG HUNG-HSIANG1HUNG CHANG YING1WENG CHAO-FU1
Top patents by PatentIndex Score
6 records- 0192US8053906B2Semiconductor package and method for processing and bonding a wireADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 8, 2011·32 cites·19 claims
- 0282US8541883B2Semiconductor device having shielded conductive viasCHENG HUNG-HSIANG·Filed 2011·Granted Sep 24, 2013·8 cites·14 claims
- 0355US8110931B2Wafer and semiconductor packageCHANG HSIAO CHUAN·Filed 2009·Granted Feb 7, 2012·1 cites·21 claims
- 0450US8076786B2Semiconductor package and method for packaging a semiconductor packageHUNG CHANG YING·Filed 2009·Granted Dec 13, 2011·1 cites·20 claims
- 0548US8018075B2Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 13, 2011·0 cites·20 claims
- 0644US2010200974A1Semiconductor package structure using the sameWENG CHAO-FU·Filed 2009·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →