Inventor · disambiguated record
Brian W. Quinlan
Also filed as: QUINLAN BRIAN W
28 granted patents·2 pending applications·38 citations·filing 2004–2024
93Inventor score
Files withIBM30
Top patents by PatentIndex Score
30 records- 0187US11282773B2Enlarged conductive pad structures for enhanced chip bond assembly yieldIBM·Filed 2020·Granted Mar 22, 2022·2 cites·13 claims
- 0287US9743526B1Wiring board with stacked embedded capacitors and method of makingIBM·Filed 2016·Granted Aug 22, 2017·8 cites·20 claims
- 0383US9601423B1Under die surface mounted electrical elementsIBM·Filed 2015·Granted Mar 21, 2017·4 cites·15 claims
- 0478US10622299B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2019·Granted Apr 14, 2020·1 cites·20 claims
- 0577US10586782B2Lead-free solder joining of electronic structuresIBM·Filed 2017·Granted Mar 10, 2020·2 cites·25 claims
- 0675US10756031B1Decoupling capacitor stiffenerIBM·Filed 2019·Granted Aug 25, 2020·2 cites·18 claims
- 0773US10607928B1Reduction of laminate failure in integrated circuit (IC) device carrierIBM·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 0872US10566275B2Element place on laminatesIBM·Filed 2019·Granted Feb 18, 2020·1 cites·8 claims
- 0968US11388821B2Thin film capacitors for core and adjacent build up layersIBM·Filed 2020·Granted Jul 12, 2022·0 cites·13 claims
- 1067US7329439B2UV-curable solvent free compositions and use thereof in ceramic chip defect repairIBM·Filed 2004·Granted Feb 12, 2008·15 cites·17 claims
- 1166US10224269B2Element place on laminatesIBM·Filed 2015·Granted Mar 5, 2019·1 cites·8 claims
- 1265US9640492B1Laminate warpage controlIBM·Filed 2015·Granted May 2, 2017·1 cites·14 claims
- 1362US10660209B2Thin film capacitors for core and adjacent build up layersIBM·Filed 2017·Granted May 19, 2020·0 cites·8 claims
- 1462US2025349580A1Verifying alignment of multiple die on a substrateIBM·Filed 2024·Application pending·0 cites
- 1561US12504747B2Multicomponent module design and fabricationIBM·Filed 2021·Granted Dec 23, 2025·0 cites·19 claims
- 1661US10224274B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2017·Granted Mar 5, 2019·0 cites·16 claims
- 1760US10224273B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2017·Granted Mar 5, 2019·0 cites·10 claims
- 1859US10892249B2Carrier and integrated memoryIBM·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 1958US9899313B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2016·Granted Feb 20, 2018·0 cites·19 claims
- 2057US10840214B2Carrier and integrated memoryIBM·Filed 2019·Granted Nov 17, 2020·0 cites·5 claims
- 2155US11239183B2Mitigating thermal-mechanical strain and warpage of an organic laminate substrateIBM·Filed 2020·Granted Feb 1, 2022·0 cites·18 claims
- 2254US10515929B2Carrier and integrated memoryIBM·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 2353US10431563B1Carrier and integrated memoryIBM·Filed 2018·Granted Oct 1, 2019·0 cites·20 claims
- 2450US11121101B2Flip chip packaging reworkIBM·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 2548US10957650B2Bridge support structureIBM·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2648US10916507B2Multiple chip carrier for bridge assemblyIBM·Filed 2018·Granted Feb 9, 2021·0 cites·23 claims
- 2744US11004614B2Stacked capacitors for use in integrated circuit modules and the likeIBM·Filed 2018·Granted May 11, 2021·0 cites·24 claims
- 2844US10770385B2Connected plane stiffener within integrated circuit chip carrierIBM·Filed 2018·Granted Sep 8, 2020·0 cites·8 claims
- 2943US11404365B2Direct attachment of capacitors to flip chip diesIBM·Filed 2019·Granted Aug 2, 2022·0 cites·8 claims
- 3035US2017179042A1Protection of elements on a laminate surfaceIBM·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →