Inventor · disambiguated record
Qinxiang Wei
Also filed as: Wei Qinxiang
7 granted patents·1 pending application·20 citations·filing 2018–2023
81Inventor score
Files withYANGTZE MEMORY TECH CO LTD8
Top patents by PatentIndex Score
8 records- 0192US10658378B2Through array contact (TAC) for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 19, 2020·9 cites·20 claims
- 0291US11716846B2Three-dimensional memory devices having through stair contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 1, 2023·2 cites·20 claims
- 0389US10847539B2Three-dimensional memory devices having through stair contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Nov 24, 2020·4 cites·20 claims
- 0487US10937806B2Through array contact (TAC) for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 2, 2021·2 cites·20 claims
- 0583US12035530B2Three-dimensional memory devices having through stair contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jul 9, 2024·0 cites·20 claims
- 0682US10825929B2Structures and methods for reducing stress in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Nov 3, 2020·3 cites·22 claims
- 0777US2023301105A1Three-dimensional memory devices having through stair contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0863US11450770B2Structures and methods for reducing stress in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
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