Inventor · disambiguated record
Kazuhiro Miyauchi
Also filed as: MIYAUCHI KAZUHIRO
6 granted patents·1 pending application·107 citations·filing 1975–2012
81Inventor score
Files withHITACHI CHEMICAL CO LTD3GOU YUTAKA1HITACHI CHEMICHAL CO LTD1NIPPON TELEGRAPH & TELEPHONE1TOYOTA MOTOR CO LTD1
Top patents by PatentIndex Score
7 records- 0188US4039961ADemodulator for combined digital amplitude and phase keyed modulation signalsNIPPON TELEGRAPH & TELEPHONE·Filed 1975·Granted Aug 2, 1977·75 cites·7 claims
- 0270US7016749B2System and method for product designing, and recording mediumTOYOTA MOTOR CO LTD·Filed 2002·Granted Mar 21, 2006·22 cites·25 claims
- 0360US9656353B2Reflow film, solder bump formation method, solder joint formation method, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2012·Granted May 23, 2017·1 cites·32 claims
- 0458US7166361B2Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jan 23, 2007·7 cites·12 claims
- 0552US6787614B2Thermosetting resin composition and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 7, 2004·2 cites·20 claims
- 0649US7736749B2Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring boardHITACHI CHEMICHAL CO LTD·Filed 2006·Granted Jun 15, 2010·0 cites·40 claims
- 0743US2011001251A1Adhesive composition, bonding member using the adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing theseGOU YUTAKA·Filed 2008·Application pending·0 cites
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