Inventor · disambiguated record
Amanda M. Hartnett
Also filed as: HARTNETT AMANDA · HARTNETT AMANDA M
3 granted patents·19 citations·filing 2010–2014
65Inventor score
Top patents by PatentIndex Score
3 records- 0184US9468136B2Low void solder joint for multiple reflow applicationsINDIUM CORP·Filed 2014·Granted Oct 11, 2016·9 cites·37 claims
- 0282US8061578B2Solder preformHARTNETT AMANDA M·Filed 2010·Granted Nov 22, 2011·10 cites·10 claims
- 0338US9010616B2Low void solder joint for multiple reflow applicationsROSS JORDAN PETER·Filed 2012·Granted Apr 21, 2015·0 cites·26 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →