Inventor · disambiguated record
Kwok Keung Paul Ho
Also filed as: HO KWOK KEUNG · HO KWOK KEUNG PAUL
19 granted patents·4 pending applications·315 citations·filing 1999–2019
94Inventor score
Files withNANO & ADVANCED MATERIALS INST LTD11CHARTERED SEMICONDUCTOR MFG9MIND TECH DEVELOPMENT LIMITED2CHARTERED SEMICONDUCOTOR MANUF1
Top patents by PatentIndex Score
23 records- 0193US9666906B2High voltage electrolyte and lithium ion batteryNANO & ADVANCED MATERIALS INST LTD·Filed 2015·Granted May 30, 2017·12 cites·10 claims
- 0290US6114243AMethod to avoid copper contamination on the sidewall of a via or a dual damascene structureCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Sep 5, 2000·123 cites·28 claims
- 0386US6417088B1Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·44 cites·22 claims
- 0486US6378759B1Method of application of conductive cap-layer in flip-chip, COB, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 30, 2002·37 cites·17 claims
- 0581US10127342B2Method of designing and modifying lithium ion battery cathode materialsNANO & ADVANCED MATERIALS INST LTD·Filed 2016·Granted Nov 13, 2018·6 cites·14 claims
- 0677US6123088AMethod and cleaner composition for stripping copper containing residue layersCHARTERED SEMICONDUCOTOR MANUF·Filed 1999·Granted Sep 26, 2000·50 cites·7 claims
- 0765US6705512B2Method of application of conductive cap-layer in flip-chip, cob, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Mar 16, 2004·10 cites·17 claims
- 0863US6387859B1Method and cleaner composition for stripping copper containing residue layersCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 14, 2002·7 cites·24 claims
- 0960US11472926B2Impact protection material and method of making the sameNANO & ADVANCED MATERIALS INST LTD·Filed 2018·Granted Oct 18, 2022·0 cites·20 claims
- 1060US6415973B1Method of application of copper solution in flip-chip, COB, and micrometal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·9 cites·25 claims
- 1158US9371979B2Method and hardware to enhance light out-couplingNANO & ADVANCED MATERIALS INST LTD·Filed 2014·Granted Jun 21, 2016·2 cites·22 claims
- 1256US10385250B2Thermally conductive composites and method of preparing sameNANO & ADVANCED MATERIALS INST LTD·Filed 2017·Granted Aug 20, 2019·0 cites·20 claims
- 1354US10329660B2Flexible transparent thin filmMIND TECH DEVELOPMENT LIMITED·Filed 2017·Granted Jun 25, 2019·0 cites·25 claims
- 1445US10103282B2Direct texture transparent conductive oxide served as electrode or intermediate layer for photovoltaic and display applicationsNANO & ADVANCED MATERIALS INST LTD·Filed 2017·Granted Oct 16, 2018·0 cites·20 claims
- 1545US6877517B2Plasma etch method for forming plasma etched silicon layerCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Apr 12, 2005·2 cites·16 claims
- 1645US6790374B1Plasma etch method for forming plasma etched silicon layerCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Sep 14, 2004·13 cites·21 claims
- 1742US11696509B2Flexible electric generator for generating electric powerNANO & ADVANCED MATERIALS INST LTD·Filed 2019·Granted Jul 4, 2023·0 cites·19 claims
- 1841US10572089B2Sensing film with an integrated structureMIND TECH DEVELOPMENT LIMITED·Filed 2018·Granted Feb 25, 2020·0 cites·13 claims
- 1941US9637384B2Fullerene derivatives and their applications in organic photovoltaicsNANO & ADVANCED MATERIALS INST LTD·Filed 2015·Granted May 2, 2017·0 cites·29 claims
- 2041US2016126505A1Solution Process Electron Transporting Layer for Polymer Light Emitting DiodeNANO & ADVANCED MATERIALS INST LTD·Filed 2014·Application pending·0 cites
- 2136US2002155693A1Method to form self-aligned anti-via interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
- 2234US2015233004A1Method of selective recovery of valuable metals from mixed metal oxidesNANO & ADVANCED MATERIALS INST LTD·Filed 2015·Application pending·0 cites
- 2333US2018114982A1Lithium manganese oxide spinel and manufacturing method thereforNANO & ADVANCED MATERIALS INST LTD·Filed 2016·Application pending·0 cites
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