Inventor · disambiguated record
Sundeep Nand Nangalia
Also filed as: NANGALIA SUNDEEP · NANGALIA SUNDEEP NAND
12 granted patents·8 pending applications·232 citations·filing 1993–2025
92Inventor score
Top patents by PatentIndex Score
20 records- 0195US9484291B1Robust pillar structure for semicondcutor device contactsAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 1, 2016·38 cites·22 claims
- 0292US7160039B2Compact optical sub-assembly with integrated flexible circuitJDS UNIPHASE CORP·Filed 2005·Granted Jan 9, 2007·45 cites·17 claims
- 0384US9245862B1Electronic component package fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2013·Granted Jan 26, 2016·10 cites·20 claims
- 0484US8946891B1Mushroom shaped bump on repassivationNANGALIA SUNDEEP NAND·Filed 2012·Granted Feb 3, 2015·10 cites·20 claims
- 0583US10236268B1Robust pillar structure for semicondcutor device contactsAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 19, 2019·4 cites·22 claims
- 0683US5499754AFluxless soldering sample pretreating systemMCNC·Filed 1994·Granted Mar 19, 1996·44 cites·22 claims
- 0780US5407121AFluxless soldering of copperMCNC·Filed 1993·Granted Apr 18, 1995·44 cites·23 claims
- 0879US8664090B1Electronic component package fabrication methodNANGALIA SUNDEEP NAND·Filed 2012·Granted Mar 4, 2014·6 cites·19 claims
- 0977US2024090123A1Nested filtersSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1076US8552557B1Electronic component package fabrication method and structureNANGALIA SUNDEEP NAND·Filed 2011·Granted Oct 8, 2013·5 cites·27 claims
- 1172US2023245978A1Shielded wafer level chip scale package with shield connected to ground with vias through dieSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1272US2023245985A1Shielded wafer level chip scale package with shield connected to ground via redistribution layersSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1372US2023245979A1Shielded wafer level chip scale package with shield connected to ground via a seal ringSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1471US2025300623A1Packaged modules having filter fan out substrateSKYWORKS SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1570US11765814B2Devices and methods related to nested filtersSKYWORKS SOLUTIONS INC·Filed 2019·Granted Sep 19, 2023·1 cites·5 claims
- 1667US5992729ATacking processes and systems for solderingMCNC·Filed 1996·Granted Nov 30, 1999·25 cites·27 claims
- 1764US2025149493A1Integrated device package with reduced thicknessSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 1862US2024371807A1Reduced-size die, related devices and methodsSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 1962US2024405009A1Devices, systems and methods related to dual-sided modulesSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 2035US8941050B1Processing solderbrace using light wavelength filter and a broadband light sourceNANGALIA SUNDEEP NAND·Filed 2012·Granted Jan 27, 2015·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →