Inventor · disambiguated record
Kenji Ohgiyama
Also filed as: OHGIYAMA KENJI
9 granted patents·292 citations·filing 1998–2003
88Inventor score
Top patents by PatentIndex Score
9 records- 0196US6309909B1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 30, 2001·208 cites·4 claims
- 0267US6215179B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 10, 2001·32 cites·17 claims
- 0358US6163069ASemiconductor device having pads for connecting a semiconducting element to a mother boardMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 19, 2000·27 cites·7 claims
- 0455US6787389B1Semiconductor device having pads for connecting a semiconducting element to a mother boardMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 7, 2004·9 cites·7 claims
- 0550US6372546B2Method of producing semiconductor device and configuration thereof, and lead frame used in said methodMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 16, 2002·5 cites·7 claims
- 0645US6907053B2Semiconductor laser device, and optical pickup apparatus using the deviceMITSUMI ELECTRIC CO LTD·Filed 2002·Granted Jun 14, 2005·2 cites·20 claims
- 0741US6901093B2Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted May 31, 2005·0 cites·6 claims
- 0837US6462406B2Semiconductor device and lead frameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 8, 2002·8 cites·7 claims
- 0928US6252306B1Method of producing semiconductor device and configuration thereof, and lead frame used in said methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 26, 2001·1 cites·10 claims
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