Inventor · disambiguated record
Isao Ichikawa
Also filed as: ICHIKAWA ISAO
21 granted patents·5 pending applications·24 citations·filing 2007–2024
91Inventor score
Top patents by PatentIndex Score
26 records- 0179US7842551B2Adhesive composition, adhesive sheet and production process for semiconductor deviceLINTEC CORP·Filed 2007·Granted Nov 30, 2010·4 cites·18 claims
- 0273US9382455B2Adhesive composition, an adhesive sheet and a production method of a semiconductor deviceLINTEC CORP·Filed 2013·Granted Jul 5, 2016·4 cites·13 claims
- 0372US9296925B2Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor deviceLINTEC CORP·Filed 2013·Granted Mar 29, 2016·3 cites·9 claims
- 0472US7674859B2Adhesive composition and adhesive sheetLINTEC CORP·Filed 2008·Granted Mar 9, 2010·6 cites·2 claims
- 0570US2025306449A1Pellicle film, pellicle, and method for measuring visible light transmittance and standard deviation of visible light transmittance of pellicle filmLINTEC CORP·Filed 2024·Application pending·0 cites
- 0670US2025306451A1Pellicle film, pellicle, and method for measuring standard deviation of orientation angle of carbon nanotubes included in pellicle filmLINTEC CORP·Filed 2024·Application pending·0 cites
- 0763US9434865B2Adhesive composition, an adhesive sheet and a production method of a semiconductor deviceLINTEC CORP·Filed 2013·Granted Sep 6, 2016·2 cites·9 claims
- 0857US7851335B2Adhesive composition, adhesive sheet and production method of semiconductor deviceLINTEC CORP·Filed 2009·Granted Dec 14, 2010·1 cites·12 claims
- 0955US8703585B2Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor deviceICHIKAWA ISAO·Filed 2012·Granted Apr 22, 2014·2 cites·5 claims
- 1054US2023018086A1Film-shaped firing material, film-shaped firing material with support sheet, multilayer body, and method for producing deviceLINTEC CORP·Filed 2020·Application pending·0 cites
- 1153US12288768B2Method of manufacturing laminateLINTEC CORP·Filed 2020·Granted Apr 29, 2025·0 cites·14 claims
- 1252US8247503B2Adhesive composition and adhesive sheetSAIKI NAOYA·Filed 2008·Granted Aug 21, 2012·1 cites·2 claims
- 1351US8716401B2Semiconductor chip laminate and adhesive composition for semiconductor chip laminationKARASAWA YASUNORI·Filed 2009·Granted May 6, 2014·1 cites·2 claims
- 1450US12406960B2Method of manufacturing laminate by sinter- bonding semiconductor chip and substrateLINTEC CORP·Filed 2020·Granted Sep 2, 2025·0 cites·10 claims
- 1550US11948865B2Film-shaped firing material and film-shaped firing material with a support sheetLINTEC CORP·Filed 2019·Granted Apr 2, 2024·0 cites·4 claims
- 1650US11267992B2Film-shaped firing material and film-shaped firing material with support sheetLINTEC CORP·Filed 2018·Granted Mar 8, 2022·0 cites·8 claims
- 1749US10131824B2Adhesive composition, adhesive sheet, and method for producing semiconductor deviceLINTEC CORP·Filed 2014·Granted Nov 20, 2018·0 cites·12 claims
- 1848US11707787B2Film-shaped firing material, film-shaped firing material provided with support sheet, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material provided with support sheetLINTEC CORP·Filed 2018·Granted Jul 25, 2023·0 cites·20 claims
- 1945US11420255B2Film-shaped firing material and film-shaped firing material with a support sheetLINTEC CORP·Filed 2018·Granted Aug 23, 2022·0 cites·5 claims
- 2045US9562179B2Adhesive composition, adhesive sheet and production process for semiconductor deviceLINTEC CORP·Filed 2015·Granted Feb 7, 2017·0 cites·14 claims
- 2144US9184082B2Adhesive composition, adhesive sheet and production process for semiconductor deviceSAIKI NAOYA·Filed 2007·Granted Nov 10, 2015·0 cites·14 claims
- 2244US2009246915A1Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor DeviceLINTEC CORP·Filed 2009·Application pending·0 cites
- 2343US2008242058A1Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor DeviceLINTEC CORP·Filed 2008·Application pending·0 cites
- 2442US11285536B2Film-shaped fired material, and film-shaped fired material with support sheetLINTEC CORP·Filed 2018·Granted Mar 29, 2022·0 cites·11 claims
- 2538US8545663B2Process for manufacturing semiconductor devicesYAMAZAKI OSAMU·Filed 2007·Granted Oct 1, 2013·0 cites·4 claims
- 2637US11219946B2Firing material composition, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material with support sheetLINTEC CORP·Filed 2018·Granted Jan 11, 2022·0 cites·6 claims
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