Inventor · disambiguated record

Chan-Yu Yeh

Also filed as: YEH CHAN-YU

1 granted patent·1 pending application·0 citations·filing 2023–2023

4Inventor score

Technology areasH10W

Files withSILICONWARE PRECISION INDUSTRIES CO LTD2

Top patents by PatentIndex Score

2 records

0149US12469774B2Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·9 claims
0246US2024282689A1Electronic package, packaging substrate and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →