Inventor · disambiguated record
Youngdal Roh
Also filed as: ROH YOUNGDAL
6 granted patents·29 citations·filing 2013–2017
78Inventor score
Top patents by PatentIndex Score
6 records- 0191US9171739B1Integrated circuit packaging system with coreless substrate and method of manufacture thereofROH YOUNGDAL·Filed 2014·Granted Oct 27, 2015·20 cites·20 claims
- 0269US9210816B1Method of manufacture of support system with fine pitchROH YOUNGDAL·Filed 2013·Granted Dec 8, 2015·2 cites·20 claims
- 0366US9171795B2Integrated circuit packaging system with embedded component and method of manufacture thereofJEON DONG JU·Filed 2014·Granted Oct 27, 2015·2 cites·20 claims
- 0465US10134664B2Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2017·Granted Nov 20, 2018·1 cites·20 claims
- 0560US9607938B2Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereofKANG MINKYUNG·Filed 2013·Granted Mar 28, 2017·2 cites·20 claims
- 0659US8975665B2Integrated circuit packaging system with coreless substrate and method of manufacture thereofJUNG JINHEE·Filed 2013·Granted Mar 10, 2015·2 cites·20 claims
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