Inventor · disambiguated record
Will J. H. Ansems
Also filed as: ANSEMS WILL · ANSEMS WILL J H
3 granted patents·2 pending applications·1 citations·filing 2006–2012
53Inventor score
Top patents by PatentIndex Score
5 records- 0154US8011082B2Method of manufacturing a package carrierKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Granted Sep 6, 2011·1 cites·6 claims
- 0249US9173315B2Package carrier for a microelectronic elementKONINKL PHILIPS ELECTRONICS NV·Filed 2012·Granted Oct 27, 2015·0 cites·12 claims
- 0342US8351222B2Package carrier for enclosing at least one microelectronic deviceKONINKL PHILIPS ELECTRONICS NV·Filed 2011·Granted Jan 8, 2013·0 cites·11 claims
- 0433US2008197432A1Microchip Assembly Produced by Transfer MoldingKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Application pending·0 cites
- 0532US2007115687A1Light-emitting unit and method of producing the sameTPO HONG KONG HOLDING LTD·Filed 2006·Application pending·0 cites
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