Inventor · disambiguated record
Richard C. Retallick
Also filed as: RETALLICK RICHARD C
4 granted patents·1 pending application·31 citations·filing 1989–2008
74Inventor score
Top patents by PatentIndex Score
5 records- 0151US7214304B2Process for preparing a non-conductive substrate for electroplatingLEE HYUNJUNG·Filed 2004·Granted May 8, 2007·5 cites·6 claims
- 0246US5213840AMethod for improving adhesion to polymide surfacesMACDERMID INC·Filed 1991·Granted May 25, 1993·13 cites·15 claims
- 0345US7063800B2Methods of cleaning copper surfaces in the manufacture of printed circuit boardsDING YING·Filed 2003·Granted Jun 20, 2006·4 cites·13 claims
- 0444US2010034965A1Direct Metallization ProcessRETALLICK RICHARD C·Filed 2008·Application pending·0 cites
- 0540US4938853AElectrolytic method for the dissolution of copper particles formed during electroless copper depositionMACDERMID INC·Filed 1989·Granted Jul 3, 1990·9 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →