Inventor · disambiguated record
Ji-Fu Kung
Also filed as: KUNG JI-FU
21 granted patents·2 pending applications·29 citations·filing 2004–2022
91Inventor score
Top patents by PatentIndex Score
23 records- 0188US8434030B1Integrated circuit design and fabrication method by way of detecting and scoring hotspotsHOU HSIN-MING·Filed 2012·Granted Apr 30, 2013·16 cites·13 claims
- 0273US9024407B2Monitoring testkey used in semiconductor fabricationHUANG CHIN-CHUN·Filed 2011·Granted May 5, 2015·5 cites·9 claims
- 0371US11916075B2Integrated circuit structure with semiconductor devices and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Feb 27, 2024·0 cites·4 claims
- 0465US11417654B2Integrated circuit structure with semiconductor devices and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Aug 16, 2022·0 cites·12 claims
- 0565US9958494B2Hierarchical wafer lifetime prediction methodUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 1, 2018·1 cites·12 claims
- 0664US10570507B2Apparatus and method for controlling operation of machineUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 25, 2020·1 cites·18 claims
- 0764US9129076B2Hierarchical wafer yield prediction method and hierarchical lifetime prediction methodUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 8, 2015·1 cites·11 claims
- 0861US9202914B2Semiconductor device and method for fabricating the sameHOU HSIN-MING·Filed 2012·Granted Dec 1, 2015·1 cites·11 claims
- 0959US11609836B2Operation method and operation device of failure detection and classification modelUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 21, 2023·0 cites·16 claims
- 1059US10784261B2Integrated circuit structure with semiconductor devices and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 22, 2020·0 cites·1 claims
- 1159US8965550B2Experiments method for predicting wafer fabrication outcomeHOU HSIN-MING·Filed 2011·Granted Feb 24, 2015·1 cites·9 claims
- 1255US11119625B1Remote control device for manufacturing equipment and method for detecting manual controlUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 14, 2021·0 cites·18 claims
- 1354US12061669B2Manufacturing data analyzing method and manufacturing data analyzing deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 13, 2024·0 cites·7 claims
- 1453US11955309B2Automatic adjustment method and automatic adjustment device of beam of semiconductor apparatus, and training method of parameter adjustment modelUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 9, 2024·0 cites·19 claims
- 1551US10529715B2Integrated circuit structure with semiconductor devices and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 7, 2020·0 cites·12 claims
- 1651US7320907B2Method for controlling lattice defects at junction and method for forming LDD or S/D regions of CMOS deviceUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jan 22, 2008·3 cites·19 claims
- 1750US9443970B2Semiconductor device with epitaxial structures and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·0 cites·11 claims
- 1849US8930865B1Layout correcting method and layout correcting systemUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jan 6, 2015·0 cites·18 claims
- 1948US2022283217A1Equipment sensing circuit board and operation method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 2044US9299624B2Stacked semiconductor structure and manufacturing method for the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·0 cites·6 claims
- 2144US8643397B2Transistor array for testingHOU HSIN-MING·Filed 2011·Granted Feb 4, 2014·0 cites·11 claims
- 2240US9159809B2Multi-gate transistor deviceHOU HSIN-MING·Filed 2012·Granted Oct 13, 2015·0 cites·19 claims
- 2336US2013061188A1Hierarchical Wafer Yield Predicting Method and Hierarchical Lifetime Predicting MethodHOU HSIN-MING·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →