Inventor · disambiguated record
Minoru Ametani
Also filed as: AMETANI MINORU
20 granted patents·5 pending applications·405 citations·filing 1984–2010
95Inventor score
Files withTOKYO SEIMITSU CO LTD8KAWASHIMA ISAMU5NITTO DENKO CORP5NITTO ELECTRIC IND CO5AMETANI MINORU2
Top patents by PatentIndex Score
25 records- 0183US5759006ASemiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewithNITTO DENKO CORP·Filed 1996·Granted Jun 2, 1998·74 cites·4 claims
- 0282US7503365B2Dicing tape attaching apparatus and dicing tape attaching methodTOKYO SEIMITSU CO LTD·Filed 2006·Granted Mar 17, 2009·8 cites·7 claims
- 0380US4631103AProcess for peeling protective film off a thin articleNITTO ELECTRIC IND CO·Filed 1984·Granted Dec 23, 1986·41 cites·4 claims
- 0478US7757741B2Apparatus for attaching a peeling tapeTOKYO SEIMITSU CO LTD·Filed 2006·Granted Jul 20, 2010·6 cites·7 claims
- 0578US7521384B2Method and apparatus for peeling surface protective filmTOKYO SEIMITSU CO LTD·Filed 2006·Granted Apr 21, 2009·7 cites·6 claims
- 0676US7438776B2Tape adhering method and tape adhering apparatusTOKYO SEIMITSU CO LTD·Filed 2005·Granted Oct 21, 2008·5 cites·8 claims
- 0775US5009735AProcess for peeling protective film off a waferNITTO DENKO CORP·Filed 1988·Granted Apr 23, 1991·50 cites·7 claims
- 0873US8151856B2Surface protection film peeling method and surface protection film peeling deviceKAWASHIMA ISAMU·Filed 2007·Granted Apr 10, 2012·6 cites·6 claims
- 0973US7740728B2Film separation method and film separation apparatusTOKYO SEIMITSU CO LTD·Filed 2006·Granted Jun 22, 2010·4 cites·8 claims
- 1073US7060154B2Method and apparatus for removing unwanted substance from semiconductor waferNITTO DENKO CORP·Filed 2001·Granted Jun 13, 2006·15 cites·10 claims
- 1171US4775438AProcess for peeling protective film off a thin articleNITTO ELECTRIC IND CO·Filed 1986·Granted Oct 4, 1988·35 cites·1 claims
- 1271US4732642AApparatus for peeling protective film off a thin articleNITTO ELECTRIC IND CO·Filed 1986·Granted Mar 22, 1988·33 cites·4 claims
- 1369US7383869B2Film peeling method and film peeling deviceTOKYO SEIMITSU CO LTD·Filed 2005·Granted Jun 10, 2008·3 cites·4 claims
- 1469US5310442AApparatus for applying and removing protective adhesive tape to/from semiconductor wafer surfacesNITTO DENKO CORP·Filed 1992·Granted May 10, 1994·47 cites·8 claims
- 1565US4865677ASticking and cutoff device for adhering adhesive tape on thin articlesNITTO ELECTRIC IND CO·Filed 1987·Granted Sep 12, 1989·35 cites·9 claims
- 1665US4522679AApparatus for sticking adhesive film on a ring and a thin articleNITTO ELECTRIC IND CO·Filed 1984·Granted Jun 11, 1985·20 cites·3 claims
- 1746US5159202AWafer shape detecting methodNITTO DENKO CORP·Filed 1990·Granted Oct 27, 1992·16 cites·9 claims
- 1846US2007267132A1Tape adhering method and tape adhering deviceKAWASHIMA ISAMU·Filed 2007·Application pending·0 cites
- 1945US7563643B2Wafer processing apparatusTOKYO SEIMITSU CO LTD·Filed 2007·Granted Jul 21, 2009·0 cites·7 claims
- 2045US7490650B2Workpiece processing deviceTOKYO SEIMITSU CO LTD·Filed 2007·Granted Feb 17, 2009·0 cites·8 claims
- 2144US2007207629A1Surface protective film peeling method and surface protective film peeling apparatusAMETANI MINORU·Filed 2007·Application pending·0 cites
- 2243US8440040B2Tape adhering method and tape adhering deviceKAWASHIMA ISAMU·Filed 2010·Granted May 14, 2013·0 cites·3 claims
- 2341US2006068566A1Film sticking method and film sticking deviceAMETANI MINORU·Filed 2005·Application pending·0 cites
- 2439US2007262276A1Cassette conveyance method and cassette conveyance apparatusKAWASHIMA ISAMU·Filed 2007·Application pending·0 cites
- 2539US2007284028A1Peeling tape adhering method and peeling tape adhering deviceKAWASHIMA ISAMU·Filed 2007·Application pending·0 cites
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